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Epoxy adhesive One-component heat-curing epoxy flexible type-EP170
Epoxy adhesive One-component heat-curing epoxy flexible type-CEMEDINE Co.,Ltd

Epoxy adhesive One-component heat-curing epoxy flexible type
CEMEDINE Co.,Ltd


About This Product

■Features

・Since no mixing process is required, there is no variation in adhesive strength due to measuring or mixing errors. ・Reactive solvent-free adhesive ・Small curing shrinkage ・High adhesiveness and durability ・Excellent insulation

■Applications

・Adhesion and sealing of electrical and electronic parts ・Adhesion of composite components for construction ・Assembling precision equipment, crafts, etc.

  • Product

    Epoxy adhesive One-component heat-curing epoxy flexible type

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1 Models of Epoxy adhesive One-component heat-curing epoxy flexible type

Image Part Number Price (excluding tax) Linear expansion coefficient (/K) Viscosity (Pa・s) Hardness Shore D Applications/Characteristics/Features Standard curing conditions Tensile shear adhesive strength (MPa) Density (g/cm3) Capacity standard Exterior Water absorption rate (%) Volume resistivity (Ω・cm) Main component Type Glass transition temperature (℃) T-type peel adhesive strength (N/mm)
Epoxy adhesive One-component heat-curing epoxy flexible type-Part Number-EP170

EP170

Available upon quote

30×10^-5

170

55

High release type

110℃×60 minutes
120℃×30 minutes

15.1

1.13

1kg/can

Pale yellow

0.23

3.0×10^15

Epoxy resin

One-component heat-curing epoxy system (flexible)

20

6.67

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About Company Handling This Product

Company Overview

Cemedine Co. Ltd. is based in Tokyo, Japan, and is an ISO 90012-certified manufacturer and supplier of sealant...

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