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  4. Diamond-based heat dissipation substrate Ag-Diamond (A.L.M.T. Corp.)
Diamond-based heat dissipation substrate Ag-Diamond-AD90
Diamond-based heat dissipation substrate Ag-Diamond-A.L.M.T. Corp.

Diamond-based heat dissipation substrate Ag-Diamond
A.L.M.T. Corp.

A.L.M.T. Corp.'s Response Status

Response Rate

100.0%

Response Time

30.1hours

Relatively Fast Response

About This Product

■Product overview

A silver and diamond heat dissipation board. It has a higher thermal conductivity of 600W/ (m･K) than Cu-Diamond, and can be applied to large area applications of 50 x 50 mm.

■Application examples

Wireless, ceramic packages, power transistor substrates, MPU, etc.

■Features

It has a higher thermal conductivity of 600W/ (m･K) than Cu-Diamond, and can be applied to large area applications of 50 x 50 mm.

  • Product

    Diamond-based heat dissipation substrate Ag-Diamond

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1 Models of Diamond-based heat dissipation substrate Ag-Diamond

Image Part Number Price (excluding tax) Thermal conductivity R.T. (W/ (m・K) ) Material Average linear expansion coefficient (ppm/K)
Diamond-based heat dissipation substrate Ag-Diamond-Part Number-AD90

AD90

Available upon quote

600

Ag-Diamond

R.T.~800℃：10.5

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About Company Handling This Product

A.L.M.T. Corp.

Response Rate

100.0%

Response Time

30.1hrs

Company Overview

A.L.M.T. Corp., founded in Japan in 1939, is a manufacturer of heat spreaders, tungsten/molybdenum powder and ...

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  • Japan

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Metal Base Substrates
Metal Base Substrates　A.L.M.T. Corp.
A.L.M.T. Corp.

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