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  4. Diamond-based heat dissipation substrate Cu-Diamond (A.L.M.T. Corp.)
Diamond-based heat dissipation substrate Cu-Diamond-DC60
Diamond-based heat dissipation substrate Cu-Diamond-A.L.M.T. Corp.

Diamond-based heat dissipation substrate Cu-Diamond
A.L.M.T. Corp.

About This Product

■Product overview

This is a copper and diamond heat dissipation board. It has a thermal expansion coefficient close to that of GaAs and GaN compound semiconductors, but a thermal conductivity higher than that of Cu. It is possible to form various metallized thin films for chip mounting and wire bonding.

■Application examples

Submounts for semiconductor lasers, substrates for power transistors, etc.

■Features

A high thermal conductivity heat dissipation board with a coefficient of thermal expansion matching that of compound semiconductors (GaAs, GaN).

  • Product

    Diamond-based heat dissipation substrate Cu-Diamond

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1 Models of Diamond-based heat dissipation substrate Cu-Diamond

Image Part Number Price (excluding tax) Thermal conductivity R.T. (W/ (m・K) ) Material Average linear expansion coefficient (ppm/K)
Diamond-based heat dissipation substrate Cu-Diamond-Part Number-DC60

DC60

Available upon quote

550

Cu-Diamond

R.T.~400℃：6.0

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About Company Handling This Product

A.L.M.T. Corp.

Company Overview

A.L.M.T. Corp., founded in Japan in 1939, is a manufacturer of heat spreaders, tungsten/molybdenum powder and ...

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  • Japan

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