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  4. Ceramic heat dissipation board Sintered Al-SiC (A.L.M.T. Corp.)
Ceramic heat dissipation board Sintered Al-SiC-Β8
Ceramic heat dissipation board Sintered Al-SiC-A.L.M.T. Corp.

Ceramic heat dissipation board Sintered Al-SiC
A.L.M.T. Corp.

A.L.M.T. Corp.'s Response Status

Response Rate

100.0%

Response Time

30.1hours

Relatively Fast Response

About This Product

■Product overview

It is a lightweight heat dissipation board that can be used in relatively complex shapes such as lid shapes, and has a specific gravity of 1/3 that of Cu. Thermal expansion can be customized by changing the composition ratio of Al and SiC. Young's modulus is 1/2 that of iron, so it can also be used as a stress relief material. The surface also has excellent adhesive adhesion.

■Application examples

Control ECU, MPU, DSP, system LSI, router LSI, etc.

■Features

・Can be manufactured at low cost with a special mold that does not require processing. ・Thermal expansion coefficient is variable depending on the type of package.

  • Product

    Ceramic heat dissipation board Sintered Al-SiC

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1 Models of Ceramic heat dissipation board Sintered Al-SiC

Image Part Number Price (excluding tax) Composition Thermal conductivity R.T. (W/ (m・K) ) Material Average linear expansion coefficient (ppm/K)
Ceramic heat dissipation board Sintered Al-SiC-Part Number-Β8

Β8

Available upon quote

70SiC-30Al

140

Al-SiC

R.T.~120℃：4.5

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About Company Handling This Product

A.L.M.T. Corp.

Response Rate

100.0%

Response Time

30.1hrs

Company Overview

A.L.M.T. Corp., founded in Japan in 1939, is a manufacturer of heat spreaders, tungsten/molybdenum powder and ...

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  • Japan

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Metal Base Substrates　A.L.M.T. Corp.
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