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  2. Boards & Circuit Boards
  3. Metal Base Substrates
  4. Alloy-based heat dissipation board CPC® (copper-copper molybdenum-copper) (A.L.M.T. Corp.)
Alloy-based heat dissipation board CPC® (copper-copper molybdenum-copper)-CPC141
Alloy-based heat dissipation board CPC® (copper-copper molybdenum-copper)-A.L.M.T. Corp.

Alloy-based heat dissipation board CPC® (copper-copper molybdenum-copper)
A.L.M.T. Corp.

About This Product

■Product overview

CPC is a heat dissipation board with a laminated structure that has a Cu layer on the top and bottom of a Cu-Mo composite material. Thermal conductivity and coefficient of linear expansion can be changed by combining the composition of the core material Cu-Mo and the lamination ratio. Additionally, since both surfaces are made of Cu, it has excellent initial heat dissipation effects.

■Application examples

Wireless communication, automotive

■Features

CPC141: Matches the coefficient of thermal expansion with alumina, and is widely used in ceramic packages using alumina.

  • Product

    Alloy-based heat dissipation board CPC® (copper-copper molybdenum-copper)

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1 Models of Alloy-based heat dissipation board CPC® (copper-copper molybdenum-copper)

Image Part Number Price (excluding tax) Composition Thermal conductivity R.T. (W/ (m・K) ) Material Average linear expansion coefficient (ppm/K)
Alloy-based heat dissipation board CPC® (copper-copper molybdenum-copper)-Part Number-CPC141

CPC141

Available upon quote

Cu/Cu-Mo/Cu

200

CPC®

R.T.~800℃：7.6

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About Company Handling This Product

A.L.M.T. Corp.

Company Overview

A.L.M.T. Corp., founded in Japan in 1939, is a manufacturer of heat spreaders, tungsten/molybdenum powder and ...

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  • Japan

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