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  4. Laser trimming device PLT-10/PLT-20 (Yamaha Robotics Holdings Co., Ltd.)
Laser trimming device PLT-10/PLT-20-PLT-10
Laser trimming device PLT-10/PLT-20-Yamaha Robotics Holdings Co., Ltd.

Laser trimming device PLT-10/PLT-20
Yamaha Robotics Holdings Co., Ltd.

Yamaha Robotics Holdings Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

39.3hours

About This Product

■Summary

・This is a device that adjusts the oscillation frequency by laser trimming the metal thin film of a tuning fork crystal resonator formed on a wafer. ・High throughput is achieved through multiple simultaneous measurements.

■Features

・High-speed trimming operation achieved by equipped with a green laser ・Achieves high throughput by measuring multiple items simultaneously. ・Uses high-speed, high-precision, and high-reliability measurement circuit ・Automatic transport is achieved using a loader/unloader. ・Display production management information in real time. ・With automatic probe cleaning mechanism

■Usage example

This is a device that uses a laser to remove the thin metal film of a tuning fork crystal resonator formed on a wafer to adjust the oscillation frequency.

■Optional support

・Can increase the number of simultaneous probing from 81 chips to 160 chips ・Supports multiple types of wafer chips by replacing dedicated jigs ・We will suggest the best trimming conditions for your product. Please contact us. Example) Picosecond, nanosecond laser, near-infrared, green laser, etc.

■External dimensions

・With NG chip break-off function W1,400 x D1,600 x H1,800mm (excluding protrusions such as Hepa filter and Patlite) ・No NG chip break-off function W1,000×D1,500×H1,750mm (excluding protrusions such as Hepa filter, computer, and patrol light)

  • Product

    Laser trimming device PLT-10/PLT-20

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1 Models of Laser trimming device PLT-10/PLT-20

Image Part Number Price (excluding tax) Parts supply Storage Image position correction Target work size Target work Number of simultaneous measurements Cycle time Option
Laser trimming device PLT-10/PLT-20-Part Number-PLT-10

PLT-10

Available upon quote

・Wafer supply from loader magazine
・Unloader Stores wafers in magazines

Chip position

4 inch wafer or less

Tuning fork crystal wafer (Model changes can be made by replacing special parts.)

Number of simultaneous probing: 80 chips or less

Approximately 0.5 seconds/piece *Takt time varies depending on the number of chips, thickness of processed film, amount of processing, and number of processing.

・The number of simultaneous probing can be increased from 81 chips to 160 chips.
・Supports multiple types by replacing dedicated jigs

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About Company Handling This Product

Yamaha Robotics Holdings Co., Ltd.

Response Rate

100.0%

Response Time

39.3hrs

  • Japan

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Laser Machinery　Yamaha Robotics Holdings Co., Ltd.
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