This product is registered by Yamaha Robotics Holdings Co., Ltd..
About This Product
■Summary
・This is a device that adjusts the oscillation frequency by laser trimming the metal thin film of a tuning fork crystal resonator formed on a wafer.
・High throughput is achieved through multiple simultaneous measurements.
■Features
・High-speed trimming operation achieved by equipped with a green laser
・Achieves high throughput by measuring multiple items simultaneously.
・Uses high-speed, high-precision, and high-reliability measurement circuit
・Automatic transport is achieved using a loader/unloader.
・Display production management information in real time.
・With automatic probe cleaning mechanism
■Usage example
This is a device that uses a laser to remove the thin metal film of a tuning fork crystal resonator formed on a wafer to adjust the oscillation frequency.
■Optional support
・Can increase the number of simultaneous probing from 81 chips to 160 chips
・Supports multiple types of wafer chips by replacing dedicated jigs
・We will suggest the best trimming conditions for your product. Please contact us. Example) Picosecond, nanosecond laser, near-infrared, green laser, etc.
■External dimensions
・With NG chip break-off function W1,400 x D1,600 x H1,800mm (excluding protrusions such as Hepa filter and Patlite)
・No NG chip break-off function W1,000×D1,500×H1,750mm (excluding protrusions such as Hepa filter, computer, and patrol light)
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