All Categories
History
Response Rate
100.0%
Response Time
39.3hours
Product
C2W compatible TCB bonder FPB-1w NeoForceHandling Company
Yamaha Robotics Holdings Co., Ltd.Categories
| Image | Part Number | Price (excluding tax) | Drive source vacuum | Drive source Power consumption | Drive source Input power supply | Drive source air | Mass | Equipment dimensions | Product name | Machine uph | Bonding accuracy | Bonding direction | Bonding compatible method | Bonding tool setting temperature | Bonding stage setting temperature | Base wafer size | Chip size | Chip wafer size | Option |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
FPB-1w NeoForce |
Available upon quote |
-75kPa (-550mmHg) or less (gauge pressure) Connection 3 φ10 tubes |
Maximum 14.0kW |
Single phase AC200V~240V±5% 50/60Hz (Please contact us for different voltages) |
570kPa (5.7kgf/cm2) 300L/min Connection φ10 Tube 3 locations |
Approximately 3,100kg (not including monitor and indicator light) |
・W 2,520mm |
Package bonder |
UPH6,000 (C4 mode/process time not included) Based on our implementation conditions |
±2.5μm (3σ) Based on our mounting conditions |
Face down/Face up (Please contact us for options/conditions) |
・TCB method (NCP/NCF/TC-CUF) |
Room temperature ~400℃ (1℃/step, pulse heat) |
Room temperature~200℃ (1℃/step) |
Φ300mm (φ200mm option) |
・1~22mm t=0.02~0.7mm (22mm or more; please contact us for options/conditions) |
・φ200mm |
・Communication interface SECSⅡ |
Reviews shown here are reviews of companies.
Reviews shown here are reviews of companies.
Response Rate
100.0%
Response Time
39.3hrs
