C2S compatible TCB bonder FPB-1s NeoForce
Yamaha Robotics Holdings Co., Ltd.
About This Product
■Summary
・Package bonder compatible with Chip to Substrate's Thermal Compression Bonding (TCB) method
・Compatible with face down construction method (Face up construction method is optional)
・Compatible with TCB method (NCP/NCF/TC-CUF), C2, C4, FO-WLP method, etc.
■Features
・Achieve high precision bonding with unique NVS [Non Vibration System] technology
・FFG [Force Free Gantry] supports high loads up to 350N
・High throughput achieved by short heating and cooling using high-speed pulse heater
- Equipped with process monitoring and management functions to achieve stable quality and process portability.
・Supports various push-up methods and can handle thin dies.
・Has a different chip bonding function for up to 4 types with a quality automatic switching function, and supports 2.5D and 3D stacking.
・High productivity/space saving achieved by multi-head system
・Flexible support for various options 1. Compatible with face up method, 2. TCB mounting of large chips (□35mm), 3. Transfer supply of FLUX material to chips, 4. Compatible with chip supply from tape reel.
Usage example
■Pulse Vacuum Reverse Multi Step (PV-RMS) that grabs a thin object to connect
The thickness of NAND flash memory, which is becoming increasingly multi-layered, is now less than 30 um, including the adhesive layer, and at this thinness, it bends freely and breaks easily. Die pickup technology is essential for device bonding, but handling ultra-thin dies poses great difficulties.
Pulse Vacuum Reverse Multi Step (PV-RMS) is a pickup method that makes good use of the bending of the device. By intermittently evacuation from the outside of the sheet, the restoring force of the bent die is used to promote efficient peeling of the die. It is effective not only for thin dies but also for dies with fragile Through Silicon Via (TSV) structures, and can be said to be a key technology for electronic device packaging in the future.
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Product
C2S compatible TCB bonder FPB-1s NeoForce
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Handling Company
Yamaha Robotics Holdings Co., Ltd.
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Categories
1 Models of C2S compatible TCB bonder FPB-1s NeoForce
| Product Image | Part Number | Price (excluding tax) |
|---|---|---|
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FPB-1s NeoForce |
Available upon quote |
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