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History
Response Rate
100.0%
Response Time
39.3hours
Product
High-speed, high-precision small chip die bonder STC-800Handling Company
Yamaha Robotics Holdings Co., Ltd.Categories
| Image | Part Number | Price (excluding tax) | Drive source vacuum | Drive source Power consumption | Drive source Input power supply | Drive source Forming gas | Drive source air | Drive source N2 gas | Product name | Work size length | Work size width | Work size thickness | Machine cycle time | Bonding accuracy | Bonding method | Frame transport | Frame feeder setting temperature | Chip size | Wafer stretching amount | Wafer size | Option |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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STC-800 |
Available upon quote |
-87kPa (-650mmHg) or less (gauge pressure) Connection: 1 φ8Tube |
・Maximum 2.23kVA (2.0kW) thermal eutectic method |
Single phase AC200V±5% 50/60Hz (Please contact us for different voltages) |
N295% + H25% (only for thermal eutectic method) |
400kPa (4kgf/cm2) 250L/min Connection: φ8Tube 2 locations |
200kPa (2kgf/cm2) 10L/min Connection: 1 φ6Tube |
Die bonder |
・120~260mm (Maximum bonding area = 10mm) Thermoeutectic method |
・20~86mm (Maximum bonding area = 76mm) Thermoeutectic method |
0.1~0.4mm |
0.140s/chip (at Y=40mm) Average 0.168s/chip based on our mounting conditions UPH21,400 |
・Standard XY:±20μm (3σ) θ:±3° (3σ) According to our mounting conditions |
・Thermal eutectic method |
・Fixed feeder pin conveyance (thermal eutectic, thermocompression bonding method) |
・Fixed feeder: Room temperature ~ 500℃ (3ch control) |
・0.12~1.5mm (Thermoeutectic, thermocompression bonding method) |
5~15mm (variable) |
Up to 8 inches |
・Magazine loader stocker method |
Reviews shown here are reviews of companies.
Reviews shown here are reviews of companies.
Response Rate
100.0%
Response Time
39.3hrs
