High-speed, high-precision small chip die bonder STC-800
Yamaha Robotics Holdings Co., Ltd.
About This Product
■Summary
・High-speed, high-precision die bonder for small chips
・Compatible with eutectic, WBC/DAF, and epoxy processes
・This is a thermal eutectic type high-speed die bonder that performs die bonding directly from the wafer to the lead frame for small dies such as small signal transistors and diodes.
- Pick up the die from the wafer and directly bond it onto the lead frame using thermal eutectic.
- Automatically detects defective die identification marks and large chips on wafer sheets and picks up only good products.
・The lead frame is supplied from the frame stack loader and stored in the unloader magazine after bonding.
■Features
・Bonding accuracy ±20μm (3σ) (±15μm (3σ) with option)
・10% improvement in UPH compared to conventional models
・Achieves high precision conveyance of lead frames by using linear drive
・Compatible with frames up to 86mm wide and Y bonding area 76mm (thermal eutectic method)
・Various functions are available to flexibly support various devices (wafer sheet stretching amount setting parameters, camera zoom function for die recognition, etc.)
- Compatible with epoxy bonding by installing an epoxy unit (dual head)
- Compatible with frames up to 100mm wide and 300mm long with universal feeder (paste dripping method)
・Achieves even higher accuracy and a variety of inspection functions by applying a die backside camera (optional)
・Process conversion kits available between eutectic, WBC/DAF*, and epoxy processes *WBC/DAF: Wafer Backside Coating / Die Attach Film
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Product
High-speed, high-precision small chip die bonder STC-800
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Handling Company
Yamaha Robotics Holdings Co., Ltd.
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Categories
1 Models of High-speed, high-precision small chip die bonder STC-800
| Product Image | Part Number | Price (excluding tax) |
|---|---|---|
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STC-800 |
Available upon quote |
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