Ultra-high precision die bonder with advanced pickup function SPA-1000-SPA-1000

Ultra-high precision die bonder with advanced pickup function SPA-1000
Yamaha Robotics Holdings Co., Ltd.

About This Product

■SummaryHigh precision twin head die bonder. A highly productive, space-saving, high-precision die bonder equipped with dual bonding heads. The automatically supplied substrate is heated and DAF* bonding is performed. After automatically feeding diced wafers, wafer mapping and defective mark recognition are performed, and suitable dies are picked up by the transfer head.

After transferring the die to the intermediate stage, it moves to the pickup point of each bonding head and supplies the die. Bonding is performed based on the results of board recognition, intermediate stage die recognition, and die back side recognition (Option). The bonded board is stored in the unloader magazine. *DAF: Die Attach Film

■Features・Achieved high precision with unique 3D-NRS (Non-Reaction Servo system) technology
・Achieves high productivity and space saving by adopting twin heads
・Equipped with a pickup unit dedicated to thin die, enabling stable high-speed pickup of t20μm/400ms (optional)
・Equipped with a bonding head with zero friction and simultaneous position and load control, compatible with thin die stack products
・Equipped with HEPA filter and full stainless steel cover for cleanliness
・Equipped with a die back camera on each bonding head. Equipped with powerful inspection functions using a total of 8 cameras
- Compatible with large boards up to 120mm wide and 300mm long

Usage example
■Pulse Vacuum Reverse Multi Step (PV-RMS) that grabs a thin object to connectThe thickness of NAND flash memory, which is becoming increasingly multi-layered, is now less than 30 um, including the adhesive layer, and at this thinness, it bends freely and breaks easily. Die pickup technology is essential for device bonding, but handling ultra-thin dies poses great difficulties.

Pulse Vacuum Reverse Multi Step (PV-RMS) is a pickup method that makes good use of the bending of the device. By intermittently evacuation from the outside of the sheet, the restoring force of the bent die is used to promote efficient peeling of the die. It is effective not only for thin dies but also for dies with fragile Through Silicon Via (TSV) structures, and can be said to be a key technology for electronic device packaging in the future.

Model
There is 1 model available for this product.

Product
Ultra-high precision die bonder with advanced pickup function SPA-1000

Handling Company
Yamaha Robotics Holdings Co., Ltd.

Categories

Semiconductor Manufacturing

Semiconductor Manufacturing Equipment Component & Part Machining

Semiconductor Manufacturing

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1 Models of Ultra-high precision die bonder with advanced pickup function SPA-1000

Image	Part Number	Price (excluding tax)	Drive source vacuum	Drive source Power consumption	Drive source Input power supply	Drive source air	Mass	Equipment dimensions	Accuracy	Productivity	Board lead frame size	Product name	Bonding accuracy	Chip size	Wafer size	Option
	SPA-1000	Available upon quote	-74kPa (-550mmHg) or less (gauge pressure)	Maximum 3.2kVA (3.2kW)	Single phase AC200V±5% 50/60Hz (Please contact us for different voltages)	500kPa (5kgf/cm2) 900L/min	Approximately 2,300kg (not including monitor and indicator light)	・W 2,280mm ・D 1,510mm ・H 1,670mm	XY:±5μm (3σ) θ:±0.05° (3σ) (machine accuracy excluding parts)	2.5 times the capacity compared to conventional machines (theoretical value based on our samples)	・Width 40~120mm ・Length 180~300mm ・Thickness 0.05~0.8mm	Die bonder	DAF joining method	0.8~25mm	Up to 12 inches	・Thin die compatible kit ・Film attach unit ・OHT compatible

Image

Part Number

Price (excluding tax)

Drive source vacuum

Drive source Power consumption

Drive source Input power supply

Drive source air

Mass

Equipment dimensions

Accuracy

Productivity

Board lead frame size

Product name

Bonding accuracy

Chip size

Wafer size

Option

SPA-1000

Available upon quote

-74kPa (-550mmHg) or less (gauge pressure)

Maximum 3.2kVA (3.2kW)

Single phase AC200V±5% 50/60Hz (Please contact us for different voltages)

500kPa (5kgf/cm2) 900L/min

Approximately 2,300kg (not including monitor and indicator light)

・W 2,280mm
・D 1,510mm
・H 1,670mm

XY:±5μm (3σ) θ:±0.05° (3σ) (machine accuracy excluding parts)

2.5 times the capacity compared to conventional machines (theoretical value based on our samples)

・Width 40~120mm
・Length 180~300mm
・Thickness 0.05~0.8mm

Die bonder

DAF joining method

0.8~25mm

Up to 12 inches

・Thin die compatible kit
・Film attach unit
・OHT compatible

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About Company Handling This Product

Yamaha Robotics Holdings Co., Ltd.

Japan

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Ultra-high precision die bonder with advanced pickup function SPA-1000 Yamaha Robotics Holdings Co., Ltd.

About This Product

■Summary

■Features

■Pulse Vacuum Reverse Multi Step (PV-RMS) that grabs a thin object to connect

1 Models of Ultra-high precision die bonder with advanced pickup function SPA-1000

SPA-1000

Customers who viewed this product also viewed

Other products of Yamaha Robotics Holdings Co., Ltd.

About Company Handling This Product

Related search keywords

Ultra-high precision die bonder with advanced pickup function SPA-1000
Yamaha Robotics Holdings Co., Ltd.