Ultra-high precision die bonder with advanced pickup function SPA-1000
Yamaha Robotics Holdings Co., Ltd.
About This Product
■Summary
High precision twin head die bonder. A highly productive, space-saving, high-precision die bonder equipped with dual bonding heads. The automatically supplied substrate is heated and DAF* bonding is performed. After automatically feeding diced wafers, wafer mapping and defective mark recognition are performed, and suitable dies are picked up by the transfer head.
After transferring the die to the intermediate stage, it moves to the pickup point of each bonding head and supplies the die. Bonding is performed based on the results of board recognition, intermediate stage die recognition, and die back side recognition (Option). The bonded board is stored in the unloader magazine. *DAF: Die Attach Film
■Features
・Achieved high precision with unique 3D-NRS (Non-Reaction Servo system) technology
・Achieves high productivity and space saving by adopting twin heads
・Equipped with a pickup unit dedicated to thin die, enabling stable high-speed pickup of t20μm/400ms (optional)
・Equipped with a bonding head with zero friction and simultaneous position and load control, compatible with thin die stack products
・Equipped with HEPA filter and full stainless steel cover for cleanliness
・Equipped with a die back camera on each bonding head. Equipped with powerful inspection functions using a total of 8 cameras
- Compatible with large boards up to 120mm wide and 300mm long
Usage example
■Pulse Vacuum Reverse Multi Step (PV-RMS) that grabs a thin object to connect
The thickness of NAND flash memory, which is becoming increasingly multi-layered, is now less than 30 um, including the adhesive layer, and at this thinness, it bends freely and breaks easily. Die pickup technology is essential for device bonding, but handling ultra-thin dies poses great difficulties.
Pulse Vacuum Reverse Multi Step (PV-RMS) is a pickup method that makes good use of the bending of the device. By intermittently evacuation from the outside of the sheet, the restoring force of the bent die is used to promote efficient peeling of the die. It is effective not only for thin dies but also for dies with fragile Through Silicon Via (TSV) structures, and can be said to be a key technology for electronic device packaging in the future.
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Product
Ultra-high precision die bonder with advanced pickup function SPA-1000
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Handling Company
Yamaha Robotics Holdings Co., Ltd.
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Categories
1 Models of Ultra-high precision die bonder with advanced pickup function SPA-1000
| Product Image | Part Number | Price (excluding tax) |
|---|---|---|
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SPA-1000 |
Available upon quote |
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