Continuous measurement of volumetric changes in resin curing shrinkage rate and shrinkage stress Resin curing shrinkage measuring device Custron
Acro Edge Co., Ltd.

Acro Edge Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

18.4hours

Relatively Fast Response

About This Product

Custron is a device that enables continuous real-time measurement of resin shrinkage and stress.

Resin curing shrinkage stress measuring device "CUSTRON" is a resin curing shrinkage stress measuring device that can continuously measure the curing shrinkage rate and shrinkage stress associated with curing of UV curing resins, thermosetting resins, epoxy resins, UV adhesives, UV inks, coatings, waxes, etc. This is a stress measurement device. It is possible to freely combine and set heat profiles for temperature rise and temperature fall, such as UV irradiation → heating → cooling, by programming. It reproduces the shrinkage rate and shrinkage stress experienced by products that are exposed to various heat during the product manufacturing process, or that are placed in various environments over long periods of time. *Design is subject to change without notice.

Features of Custron
■Continuous measurement of the entire process before, during and after the reactionContinuous measurement of curing shrinkage rate and shrinkage stress associated with curing of UV curing resins, thermosetting resins, epoxy resins, UV adhesives, UV inks, coatings, waxes, etc.

■Heat cycle measurementThermal profiles of rising and falling temperatures such as UV irradiation → heating → cooling can be freely combined and set by program (room temperature to 180°C) *Up to 300°C is possible with options

■Environment reproductionReproduces the shrinkage rate and shrinkage stress that products undergo when subjected to various heat during the product manufacturing process and when placed in various environments over long periods of time.

■Temperature changes on the resin surface can be measured.・A small amount of sample (1cc) is OK.
・No need for special measurement techniques

■Device configuration・Touch panel input method for setting conditions, etc.
・Data is automatically collected using PC Excel (measurement up to 30,000 steps)
・Temperature setting: normal temperature to 180℃ (can be changed with options)
・Temperature increase setting programmable by program temperature control
・It may not be stable depending on the settings.
・Irradiation device and temperature settings can be linked
・It may not be possible to interlock depending on the irradiation device.

■Consumables (first set)・Load cell probe finished product...10 pieces
・Resin washer
 (t=1mm　φ=10mm　・・・3 pieces) (t=2mm　φ=10mm　・・・3 pieces)
・Slide glass...100 pieces
・Squeegee spatula...1 piece
・Aluminum foil for shrinkage rate measurement φ10...10 pieces

Model
There is 1 model available for this product.

Product
Continuous measurement of volumetric changes in resin curing shrinkage rate and shrinkage stress Resin curing shrinkage measuring device Custron

Handling Company
Acro Edge Co., Ltd.

Categories

Meters & Instruments

Stress Analyzers

140+ people viewing

Last viewed: 9 hours ago

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1 Models of Continuous measurement of volumetric changes in resin curing shrinkage rate and shrinkage stress Resin curing shrinkage measuring device Custron

Image	Part Number	Price (excluding tax)	Current (A)	Voltage (V)	Weight (kg)	Laser displacement meter for curing shrinkage rate measurement	Load cell for stress measurement	Dimensions (measuring unit body touch panel control unit)	Dimensions (data import notebook PC cooling water circulation system)	Warming heater	Cooling water circulation device
	Custron/Custron	Available upon quote	Touch panel control section 15 Cooling water circulation device 5	Touch panel control section 100 Cooling water circulation device 100	Measuring unit body 28 Touch panel control section 5 Laptop PC for data acquisition 2 Cooling water circulation device 32	1) Repeat accuracy 2μm 2) Output 220μW	1) Standard rating 5N 2) Repeat accuracy within ±0.5%RO	Measuring unit body W450 x D400 x H900 Touch panel control unit W500 x D420 x H310	Laptop PC for data acquisition W380 x D420 x H35 Cooling water circulation system W218 x D430 x H563	1) 150W x 3 (total 450W) Heat resistance 500℃ (maximum setting temperature 180℃) 2) Measurement temperature sensor K thermocouple 3) Temperature sensor K thermocouple for safety limit	1) Freezer 450W AC100V 2) Setting from 10℃ to room temperature (The set temperature may not be achieved depending on the usage conditions.)

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About Company Handling This Product

Acro Edge Co., Ltd.

Response Rate

100.0%

Response Time

18.4hrs

Japan

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Continuous measurement of volumetric changes in resin curing shrinkage rate and shrinkage stress Resin curing shrinkage measuring device Custron Acro Edge Co., Ltd.

Acro Edge Co., Ltd.'s Response Status

About This Product

■Continuous measurement of the entire process before, during and after the reaction

■Heat cycle measurement

■Environment reproduction

■Temperature changes on the resin surface can be measured.

■Device configuration

■Consumables (first set)

1 Models of Continuous measurement of volumetric changes in resin curing shrinkage rate and shrinkage stress Resin curing shrinkage measuring device Custron

Custron/Custron

Customers who viewed this product also viewed

Other products of Acro Edge Co., Ltd.

About Company Handling This Product

Related search keywords

Continuous measurement of volumetric changes in resin curing shrinkage rate and shrinkage stress Resin curing shrinkage measuring device Custron
Acro Edge Co., Ltd.