Continuous measurement of volumetric changes in resin curing shrinkage rate and shrinkage stress Resin curing shrinkage measuring device Custron
Acro Edge Co., Ltd.
About This Product
Custron is a device that enables continuous real-time measurement of resin shrinkage and stress.
Resin curing shrinkage stress measuring device "CUSTRON" is a resin curing shrinkage stress measuring device that can continuously measure the curing shrinkage rate and shrinkage stress associated with curing of UV curing resins, thermosetting resins, epoxy resins, UV adhesives, UV inks, coatings, waxes, etc. This is a stress measurement device. It is possible to freely combine and set heat profiles for temperature rise and temperature fall, such as UV irradiation → heating → cooling, by programming. It reproduces the shrinkage rate and shrinkage stress experienced by products that are exposed to various heat during the product manufacturing process, or that are placed in various environments over long periods of time. *Design is subject to change without notice.
Features of Custron
■Continuous measurement of the entire process before, during and after the reaction
Continuous measurement of curing shrinkage rate and shrinkage stress associated with curing of UV curing resins, thermosetting resins, epoxy resins, UV adhesives, UV inks, coatings, waxes, etc.
■Heat cycle measurement
Thermal profiles of rising and falling temperatures such as UV irradiation → heating → cooling can be freely combined and set by program (room temperature to 180°C) *Up to 300°C is possible with options
■Environment reproduction
Reproduces the shrinkage rate and shrinkage stress that products undergo when subjected to various heat during the product manufacturing process and when placed in various environments over long periods of time.
■Temperature changes on the resin surface can be measured.
・A small amount of sample (1cc) is OK.
・No need for special measurement techniques
■Device configuration
・Touch panel input method for setting conditions, etc.
・Data is automatically collected using PC Excel (measurement up to 30,000 steps)
・Temperature setting: normal temperature to 180℃ (can be changed with options)
・Temperature increase setting programmable by program temperature control
・It may not be stable depending on the settings.
・Irradiation device and temperature settings can be linked
・It may not be possible to interlock depending on the irradiation device.
■Consumables (first set)
・Load cell probe finished product...10 pieces
・Resin washer
(t=1mm φ=10mm ・・・3 pieces) (t=2mm φ=10mm ・・・3 pieces)
・Slide glass...100 pieces
・Squeegee spatula...1 piece
・Aluminum foil for shrinkage rate measurement φ10...10 pieces
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Product
Continuous measurement of volumetric changes in resin curing shrinkage rate and shrinkage stress Resin curing shrinkage measuring device Custron
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Handling Company
Acro Edge Co., Ltd.
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Categories
1 Models of Continuous measurement of volumetric changes in resin curing shrinkage rate and shrinkage stress Resin curing shrinkage measuring device Custron
| Product Image | Part Number | Price (excluding tax) |
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Custron/Custron |
Available upon quote |
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About Company Handling This Product
- Japan