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3D-X-ray stereo method® X-ray inspection equipment FX-400tRX-FX-400tRX
3D-X-ray stereo method® X-ray inspection equipment FX-400tRX-iBit Co., Ltd.

3D-X-ray stereo method® X-ray inspection equipment FX-400tRX
iBit Co., Ltd.


About This Product

Although it is a closed type X-ray device, it achieves a high resolution of 2μm.

■Summary

・High resolution of 2μm and geometric magnification of 500x make it possible to obtain clear X-ray images. ・You can obtain the same image quality for samples that would conventionally require an expensive open-type X-ray tube. ・We can also inspect the connection parts of IC wire bonds and copper wires. It is also possible to observe through holes inside printed circuit boards. ・High output of 110kV and 200μA makes it possible to penetrate 3mm thick copper plates.

■Features

・Equivalent image quality can be obtained for specimens that would conventionally require an expensive open X-ray tube. ・Inspection of IC wire bonding connections and copper wires is also possible. ・Through holes inside printed circuit boards can also be observed. ・110kV, 200μA high output X-ray source can penetrate copper plates (3mm) etc. - Acquire images of minute parts with high resolution 2μm image resolution ・High magnification photography with 500x geometric magnification ・Separation of the front and back sides of the mounting board using the X-ray stereo method (about 4 seconds) ・Obtain 300 layers of horizontal cross sections of the mounting board using X-ray stereo CT method (about 50 seconds) ・Automatic inspection using CT function (OK/NG judgment) ・Traceability support using 2D code

■Inspection items

・BGA crack observation ・Observation of unsoldered parts of BGA ・Observation of IC wire bonding ・Poor bonding of LGA ・Defective printed wiring board ・Through-hole X-ray observation of mounting board ・X-ray observation of through holes ・Observation of IC wire bonding ・Detailed case study of raw board inspection ・BGA inspection/mounted board inspection

  • Product

    3D-X-ray stereo method® X-ray inspection equipment FX-400tRX

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1 Models of 3D-X-ray stereo method® X-ray inspection equipment FX-400tRX

Image Part Number Price (excluding tax) Power supply Equipment weight Equipment dimensions Display display Inspection area Inspection tray size Minimum X-ray focal diameter Geometric magnification Monitor display magnification Z2 axis stroke Z1 axis stroke X-ray tube voltage, tube current X-ray tube type X-ray image resolution X-ray leakage dose X-ray target position Q-axis stroke CCD camera part type Option
3D-X-ray stereo method® X-ray inspection equipment FX-400tRX-Part Number-FX-400tRX

FX-400tRX

Available upon quote

Single phase AC200~230V, 1.5kVA

1,200kg

1,300 (W) × 1,100 (D) × 1,480 (H) mm

24 inch LCD

330×250mm

330×250mm

2μm

500x, FOD: X-ray source-sample distance (minimum) = 1.0mm, FID: X-ray source-receiver distance (maximum) = 500mm, 500/1.0 = 500x

3000x X-ray receiver sensor dimensions = 50 x 50mm, 24 inch monitor display area dimensions = 300 x 300mm Image display dimensions/X-ray receiver = 300/50 = 6x, geometric magnification x display magnification = 500 x 6 =3000 times

Z2 (X-ray tube top and bottom): 0~80mm

Z1 (X-ray camera top and bottom): 60~500mm

40 - 110kV, 200μA

Microfocus sealed source (closed type)

1.3 million pixel X-ray flat panel, 1,180 x 1,100 pixels, 14bit (16,384 gradations)

1μSv/h or less, no X-ray handling qualification required (if overseas, please follow the laws and regulations of the country of installation)

Transparent target (same method as open tube)

Q-axis (X-ray camera tilt): 0~60°

Color CCD camera (for photographing workpieces)

Stereo CT, V-CT (vertical direction), P-CT (diagonal direction), manipulator, turntable, automatic inspection, repair station (QR traceability compatible)

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