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  4. Die bonder LD manufacturing equipment KFA-11 (Kosaka Laboratory Ltd.)
Die bonder LD manufacturing equipment KFA-11-KFA-11
Die bonder LD manufacturing equipment KFA-11-Kosaka Laboratory Ltd.

Die bonder LD manufacturing equipment KFA-11
Kosaka Laboratory Ltd.

Kosaka Laboratory Ltd.'s Response Status

Response Rate

100.0%

Response Time

72.2hours

About This Product

■Features

This is LD manufacturing equipment that can be used for both LD chips and PD chips. Application: LD manufacturing

  • Product

    Die bonder LD manufacturing equipment KFA-11

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1 Models of Die bonder LD manufacturing equipment KFA-11

Image Part Number Price (excluding tax)
Die bonder LD manufacturing equipment KFA-11-Part Number-KFA-11

KFA-11

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About Company Handling This Product

Kosaka Laboratory Ltd.

Response Rate

100.0%

Response Time

72.2hrs

Company Overview

Kosaka Laboratory Ltd., a company founded in 1950 and headquartered in Tokyo, Japan, is a manufacturer and sup...

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  • Japan

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Semiconductor Manufacturing Equipment Component & Part Machining
Semiconductor Manufacturing Equipment Component & Part Machining　Kosaka Laboratory Ltd.
Kosaka Laboratory Ltd.

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