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  4. Surface roughness measuring device 3D white interference microscope from sub-nano roughness to millimeter roughness Non-contact 3D surface roughness/shape measuring device Opt-scope (Meishin Koki Co., Ltd.)
Surface roughness measuring device 3D white interference microscope from sub-nano roughness to millimeter roughness Non-contact 3D surface roughness/shape measuring device Opt-scope-Opt-scope R
Surface roughness measuring device 3D white interference microscope from sub-nano roughness to millimeter roughness Non-contact 3D surface roughness/shape measuring device Opt-scope-Meishin Koki Co., Ltd.

Surface roughness measuring device 3D white interference microscope from sub-nano roughness to millimeter roughness Non-contact 3D surface roughness/shape measuring device Opt-scope
Meishin Koki Co., Ltd.

Meishin Koki Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

17.9hours

Company Review

5.0

Relatively Fast Response

About This Product

■Summary

・3D white interference microscope for measuring nano-level surface properties ・Measure the surface roughness and shape of machined parts in a short time without contact Features

■High efficiency

Measures three-dimensional surface texture in a short time. Time can be reduced by more than 100 times compared to contact-type measuring machines

■Stability

Tokyo Seimitsu's unique white interference fringe peak detection algorithm (DEAP) obtains stable shape data from fine roughness shapes to machined surfaces.

■Easy to operate

Abundant analysis and outstanding operability using the well-established ACCTee and SurfcomMap

■Recommended for the following industries

・Machined parts (surface quality evaluation of machined surfaces such as milling cutters) ・Semiconductor related (wafer) ・Rubber roller ・Whetstone grain analysis - Textured resin molded products, etc.

■Focus variation measurement function

・High-speed scanning of millimeter shapes ・A focus variation measurement function using all-focus imaging microscopy (focus variation microscopy), which is specified as a measurement method in the three-dimensional surface texture international standard ISO 25178-6:2010, has been added as a new option. (factory option)

■Measurement can be completed in a short time due to white interference method

Using the principle of white interference, the surface roughness and shape of machined parts can be measured non-contact and in a short time. Since there is no need for scanning in the X and Y axes, which is required with stylus-type three-dimensional surface roughness measuring machines, the measurement speed is overwhelmingly fast and measurements can be completed in a short time.

■Unique white interference fringes

Peak detection method DEAP Deep (Algorithm for Detection of Envelope and Absolute Phase) is Tokyo Seimitsu's unique envelope/absolute phase detection algorithm. It has a wider measurement range than PSI (phase shift interferometry), higher resolution and wider measurement range than VSI (vertical scanning interferometry), and calculates envelopes with higher sensitivity. Deep's measurement noise reduction effect provides overwhelming effective resolution, making it possible to obtain clearer shape data even on sloped surfaces of machined parts that were previously difficult to measure.

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    Surface roughness measuring device 3D white interference microscope from sub-nano roughness to millimeter roughness Non-contact 3D surface roughness/shape measuring device Opt-scope

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1 Models of Surface roughness measuring device 3D white interference microscope from sub-nano roughness to millimeter roughness Non-contact 3D surface roughness/shape measuring device Opt-scope

Image Part Number Price (excluding tax) Voltage Vibration isolation table Scanning speed Scanning range (Z) Air source (with passive vibration isolation) Environmental temperature Measuring unit external dimensions Width/Depth/Height Measuring range (X,Y) Measurement principle Temperature change Power consumption Step repeatability σ Body mass Maximum measurement height Maximum measurement workpiece height Tilt table Maximum measurement workpiece height When XY table is installed Image sensor Indication accuracy (Z) Vertical display resolution Resolution (Z) Light source Lens mounting method Tilt table loadable weight Tilt table tilt range Z-axis indication accuracy XY motorized stage loadable weight XY electric stage stroke Sq repeatability σ Number of CCD pixels CCD resolution (X,Y)
Surface roughness measuring device 3D white interference microscope from sub-nano roughness to millimeter roughness Non-contact 3D surface roughness/shape measuring device Opt-scope-Part Number-Opt-scope R

Opt-scope R

Available upon quote

Single phase AC100/110±10% (50/60 Hz)

Passive method or active method *Optional function

2 ~ 100 µm/sec
1 ~ 12 µm/sec

20mm

Supply pressure 0.35 - 0.7 Mpa

18~30℃

620mm / 800mm / 1,532mm
With column spacer option: 620 mm / 800 mm / 1,662 mm

Approximately 1.7×1.7mm

Vertical scanning low coherence interferometry
All-in-focus imaging microscopy (focus variation) *Optional feature

±0.5℃/hour

1,200W

0.05%

175kg
With column spacer option: 183 kg

200mm

159 mm (with column spacer option: 289 mm *optional function)

58 mm (with column spacer option: 188 mm *optional function)

Color CMOS image sensor *Optional function
Monochrome CMOS image sensor

0.8±｜2H/100｜μm

0.01nm

0.1nm

White LED

5 hole revolver type

20kg

± 1°

0.1 +|H/1,000| µm (H: measurement height µm)

14kg *Optional function

±12.5 mm or ±25 mm *Optional function

0.005nm

2,048×2,048

1.10μm

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About Company Handling This Product

Meishin Koki Co., Ltd.

Response Rate

100.0%

Response Time

17.9hrs

Company Review

5.0
  • Japan

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