Embedded wireless LAN module SDIO interface SX-SDPAC
Silex Technology Co., Ltd.
About This Product
■Summary
SDIO SiP (System-in-Package) module equipped with Qualcomm's QCA9377 system-on-chip (SoC) and compatible with IEEE 802.11a/b/g/n/ac and Bluetooth® v5.0 BR/EDR/LE. . As host interfaces, it is equipped with an SDIO3.0 interface for wireless LAN and a high-speed UART interface for Bluetooth®.
This product has a built-in RF front end, which reduces the development burden of RF peripheral circuits and allows both 5GHz and 2.4GHz bands to be controlled with a single external antenna. In addition, its compact size of 6.9mm x 6.9mm contributes to the miniaturization of customers' boards.
■Product features
・Dual band Wi-Fi & Bluetooth® v5.0 compatible
・Low power consumption 1x1 SiP module
・Uses Qualcomm QCA9377-3 SoC
・PHY data rate maximum 433Mbps (at 11ac VHT80)
・Equipped with a wireless LAN host interface compatible with SDIO3.0
・Supports UART as Bluetooth® host interface
・Main power supply 3.3V, IO power supply 1.8V or 3.3V
・RoHS directive compliant (2011/65/EC)
・Small size 6.9 x 6.9 x 1.1 mm
・80 pin LGA package
■Wireless driver
・Reference platform NXP i.MX6 SoloX
・Supported OS Linux
・Supported functions Operation mode Access Point (8 units that can be connected), Authentication method Open System, WPA2-PS, Encryption method None, AES WPS v2.0 (PBC, PIN code, external registrar supported), WDS
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Product
Embedded wireless LAN module SDIO interface SX-SDPAC
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Handling Company
Silex Technology Co., Ltd.
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Categories
1 Models of Embedded wireless LAN module SDIO interface SX-SDPAC
| Product Image | Part Number | Price (excluding tax) |
|---|---|---|
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SX-SDPAC-2830 |
Available upon quote |
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