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Embedded wireless LAN module SDIO interface​ SX-SDPAC-SX-SDPAC-2830
Embedded wireless LAN module SDIO interface​ SX-SDPAC-Silex Technology Co., Ltd.

Embedded wireless LAN module SDIO interface​ SX-SDPAC
Silex Technology Co., Ltd.

Silex Technology Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

10.7hours

Fast Response


About This Product

■Summary

SDIO SiP (System-in-Package) module equipped with Qualcomm's QCA9377 system-on-chip (SoC) and compatible with IEEE 802.11a/b/g/n/ac and Bluetooth® v5.0 BR/EDR/LE. . As host interfaces, it is equipped with an SDIO3.0 interface for wireless LAN and a high-speed UART interface for Bluetooth®. This product has a built-in RF front end, which reduces the development burden of RF peripheral circuits and allows both 5GHz and 2.4GHz bands to be controlled with a single external antenna. In addition, its compact size of 6.9mm x 6.9mm contributes to the miniaturization of customers' boards.

■Product features

・Dual band Wi-Fi & Bluetooth® v5.0 compatible ・Low power consumption 1x1 SiP module ・Uses Qualcomm QCA9377-3 SoC ・PHY data rate maximum 433Mbps (at 11ac VHT80) ・Equipped with a wireless LAN host interface compatible with SDIO3.0 ・Supports UART as Bluetooth® host interface ・Main power supply 3.3V, IO power supply 1.8V or 3.3V ・RoHS directive compliant (2011/65/EC) ・Small size 6.9 x 6.9 x 1.1 mm ・80 pin LGA package

■Wireless driver

・Reference platform NXP i.MX6 SoloX ・Supported OS Linux ・Supported functions Operation mode Access Point (8 units that can be connected), Authentication method Open System, WPA2-PS, Encryption method None, AES WPS v2.0 (PBC, PIN code, external registrar supported), WDS

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    Embedded wireless LAN module SDIO interface​ SX-SDPAC

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1 Models of Embedded wireless LAN module SDIO interface​ SX-SDPAC

Image Part Number Price (excluding tax) Weight Wireless standards Current consumption Wireless LAN 5GHz Current consumption Wireless LAN 2.4GHz Current consumption Bluetooth® Packing unit Packing Dimensions length Dimensions horizontal External dimensions Thickness Operating voltage Main power supply Operating voltage SDIO power supply For SDIO3.0 operation Operating voltage SDIO power supply For SDIO2.0 operation Operating environmental conditions Humidity conditions Operating environment conditions Temperature conditions Storage environmental conditions Humidity environment Storage environmental conditions Temperature conditions Host interface Package type Chipset Type Bluetooth® standard
Embedded wireless LAN module SDIO interface​ SX-SDPAC-Part Number-SX-SDPAC-2830

SX-SDPAC-2830

Available upon quote

0.2g

IEEE 802.11a/b/g/n/ac (1x1)

Transmission: 490mA Reception: 115mA

Transmission: 340mA Reception 85mA

Transmission: 90mA Reception: 45mA

3,000 types

Reel

6.9mm

6.9mm

1.1mm

3.3V

1.8V

1.8V or 3.3V

~85%RH (no condensation)

-20~70℃

~85%RH (no condensation)

-40~85℃

Wireless LAN:SDIO3.0,Bluetooth®:UART

LGA 80pin package

QCA9377-3

Mass production SKU

Bluetooth® v5.0 (BR/EDR/LE compliant)

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About Company Handling This Product

Response Rate

100.0%


Response Time

10.7hrs

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