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Built-in wireless LAN module SDIO interface SX-SDMAC-2830S-SX-SDMAC-2830S
Built-in wireless LAN module SDIO interface SX-SDMAC-2830S-Silex Technology Co., Ltd.

Built-in wireless LAN module SDIO interface SX-SDMAC-2830S
Silex Technology Co., Ltd.

Silex Technology Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

10.7hours

Fast Response


About This Product

■Summary

This product is an SDIO type wireless LAN combo module that supports IEEE 802.11a/b/g/n/ac and Bluetooth®. This product is equipped with Qualcomm's QCA9377 chipset and is compatible with the high-speed communication standard IEEE 802.11ac, making it possible to wirelessly transmit large amounts of data at high speed. In addition, it can be used in a wide range of products by supporting the wide temperature range required for industrial applications.

■Product features

・PHY data rate maximum 433Mbps (at 11ac VHT80) ・Single stream 1× ・Uses Qualcomm QCA9377 chipset ・Host interface Wireless LAN SDIO3.0 compatible, Bluetooth® UART ・80MHz band mode (5GHz) ・High-density modulation mode (256QAM) compatible with both 2.4GHz/5GHz ・Bluetooth® v5.0 Class2 compatible ・Surface mount, connector, and SD card types can be selected ・RoHS compliant ・Compatible with wireless standards: Japan, America, Canada, Europe, UK

■Driver license (wireless LAN)

・Supports Linux Station, Access Point function, WPA™/WPA2™/WPA3™ authentication methods, IEEE 802.1X (TLS, T TLS, PEAP), WPS2.0, Wi-Fi Direct ・Android ・Windows Windows Embedded Compact 7, Windows Embedded Compact 2013, Windows10/Windows10 IoT

■Driver license (Bluetooth®)

Compatible standards Bluetooth® v5.0 Class2

  • Product

    Built-in wireless LAN module SDIO interface SX-SDMAC-2830S

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1 Models of Built-in wireless LAN module SDIO interface SX-SDMAC-2830S

Image Part Number Price (excluding tax) Weight Sales unit Embedded use Compatible with wireless standards Wireless LAN specifications Current consumption Wireless LAN 5GHz Current consumption Wireless LAN2.4GHz Current consumption Bluetooth® Packing form Shape Dimensions length Dimensions horizontal External dimensions Thickness Operating voltage Main power supply Operating voltage SDIO power supply For SDIO3.0 operation Operating voltage SDIO power supply For SDIO2.0 operation Operating environmental conditions Humidity conditions Operating environment conditions Temperature conditions Storage environmental conditions Humidity environment Storage environmental conditions Temperature conditions Host interface Package type Chipset Antenna terminal Bluetooth® specifications
Built-in wireless LAN module SDIO interface SX-SDMAC-2830S-Part Number-SX-SDMAC-2830S

SX-SDMAC-2830S

Available upon quote

1.7g

500 type

Medical equipment, mobile printers, handy terminals, AV equipment, barcode readers, surveillance cameras, industrial equipment, sensor equipment, video equipment

Japan, America, Canada, Europe, UK

IEEE 802.11a/b/g/n/ac (1x1)

Transmission: 570mA Reception: 140mA

Transmission: 400mA Reception: 110mA

Transmission: 30mA Reception: 40mA

Reel

Surface mount

19.0mm

30.0mm

2.6mm

3.3V

1.8V

1.8V or 3.3V

15~95%RH (no condensation)

-40~85℃

10~95%RH (no condensation)

-40~105℃

Wireless LAN:SDIO3.0,Bluetooth®:UART

60pins Direct Solder Pads

QCA9377-3

MHF connector: 1 piece, chip antenna: 1 piece

Bluetooth® v5.0 (BR/EDR/LE compliant)

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About Company Handling This Product

Response Rate

100.0%


Response Time

10.7hrs

  • Japan

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