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Price (excluding tax)
Response Rate
100.0%
Response Time
24.9hours
Relatively Fast Response
■ Overview "Alem Cobond 2315X" is an epoxy adhesive with excellent thermal conductivity. The performance of the conventional Alem Cobond 2315 has been improved as the crack resistance and adhesive strength have been improved. In the thermal conductivity epoxy adhesive, the viscosity is low, so it can be used as a filling or coating. Insulation and corrosion resistance are also good. ■ Characteristics "Alem Cobond 2315X" is a low -viscosity, black and heat -resistant epoxy adhesive. It has a high thermal conductivity, has a low shrinkage rate after firing, and has excellent insulation. In addition, there are few outgus and the standard of NASA is suitable. Good chemical resistance and has excellent acid, alkali, organic solvents and salt. The "Alem Cobond 2315X" is useful for potting and encapsulation such as high -density package power supply, lectifier, integrated circuit, thick film composite device, digital analog converter, oscillator, relay, trance and semiconductor. ■ How to use The "Alem Cobond 2315X" mixes the curing agent A25 to the resin -based B100 at the weight ratio. The viscosity at the time of mixing is 4,000 cp, and the pot life is 8 hours at room temperature for 100 grams. After binding, it is gradually fired at 71 ° C at 71 ° C and then 2 hours at 149 ° C. Alternatively, it hardens even for 4 hours at 105 ° C. In addition, when using in vacuum, bake at 125 ° C for more than 4 hours after normal baking to out -gas.
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Electric resistance rate (ω • cm)
Filler
Heat expansion coefficient (cm/cm/℃ x 10^-6)
Heat resistance upper limit (℃)
Rust resistance
Thermal conductivity (W/m • K)
capacity
color
Component number of components
Density (G/CM^3)
Escape force (kgf/cm^2)
In -furnace -grilled heating firing
Mixed viscosity @25 ℃ (CP)
Pulling slick intensity (PSI)
Mixed volume ratio (main agent: curing agent)
Pot life (100g amount 25 ° C time)
Insulation (KV/mm)
Dedicated intensity (PSI)
Indirect dielectric
Part Number
Aremkobond 2315XProduct
Conductive, heat -resistant, high -heat conductivity conductive or thermal conductivity adhesiveHandling Company
Edec Co., Ltd.Categories
| Image | Price (excluding tax) | Dedicated intensity (PSI) | Electric resistance rate (ω • cm) | Heat resistance upper limit (℃) | Indirect dielectric | Insulation (KV/mm) | Mixed viscosity @25 ℃ (CP) | Pot life (100g amount 25 ° C time) | Thermal conductivity (W/m • K) | capacity |
|---|---|---|---|---|---|---|---|---|---|---|
| Available upon quote | 12,300 | 1.0 × 10^16 | 185 | 4.7 (at 1kHz) | 480 | 4,000 | 8 hours | 1.2 | 1 Pint (≒ 500ml), 1 quote (≒ 1L) |
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Response Rate
100.0%
Response Time
24.9hrs
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