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Conductive, heat -resistant, high -heat conductivity conductive or thermal conductivity adhesive-Edec Co., Ltd.

Price (excluding tax)

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Edec Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

24.9hours

Relatively Fast Response


Model Description

■ Overview "Alem Cobond 556" is an epoxy -based conductive heat -resistant adhesive filled with silver particles. It is used to assemble electronic components and vacuum parts that require conductivity and thermal conductivity. Excellent electrical conductivity and thermal conductivity. Epoxy -based 2 liquid and can be cured at room temperature. * Alem Cobond 556 also has a low-resistance, high-temperature 556-HT-HC and a high-temperature 556-HT-SP exclusively for screen prints. ■ How to use Introduction or coating the surface of glue or coating with a shot blast or sandpaper, and completely remove dust, oil, shot blast, and sandpaper residue with a cleaning agent. Next, mix the resin base B and the hardening agent A with a weight ratio of 1: 1 well. The pot life is about 1 hour. Apply thinly on the wearing body and stick together immediately. Once the bodies are paste, bake at 93 ° C for 2 hours or leave at room temperature for more than 24 hours to harden them. ■ Application example ・ Repair of printed circuit boards ・ Sensor used in vacuum ・ High temperature connector and special light source ・ IC chips, semiconductor parts, etc.


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Electric resistance rate (ω • cm)

Filler

Heat expansion coefficient (cm/cm/℃ x 10^-6)

Heat resistance upper limit (℃)

Rust resistance

Thermal conductivity (W/m • K)

capacity

color

Component number of components

Density (G/CM^3)

Escape force (kgf/cm^2)

In -furnace -grilled heating firing

Mixed viscosity @25 ℃ (CP)

Pulling slick intensity (PSI)

Mixed volume ratio (main agent: curing agent)

Pot life (100g amount 25 ° C time)

Insulation (KV/mm)

Dedicated intensity (PSI)

Indirect dielectric

See all 7 models in list
  • Part Number

    Aremkobond 556

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Conductive, heat -resistant, high -heat conductivity conductive or thermal conductivity adhesive Aremkobond 556's performance table

Image Price (excluding tax) Component number of components Density (G/CM^3) Electric resistance rate (ω • cm) Escape force (kgf/cm^2) Filler Heat expansion coefficient (cm/cm/℃ x 10^-6) Heat resistance upper limit (℃) In -furnace -grilled heating firing Mixed viscosity @25 ℃ (CP) Mixed volume ratio (main agent: curing agent) Pot life (100g amount 25 ° C time) Rust resistance Thermal conductivity (W/m • K) capacity color
Conductive, heat -resistant, high -heat conductivity conductive or thermal conductivity adhesive-Part Number-Aremkobond 556 Available upon quote 2 3.2 0.0009 119.5 Silver 25 171 Room temperature x 24 HRS. Or 93 ° C x2hrs. 35,000 ~ 40,000 1: 1 1hrs. excellence 2.2 50g (2 liquid total) Silver

There are 7 models for this product.

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About Company Handling This Product

Response Rate

100.0%


Response Time

24.9hrs

  • Japan

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