・ Boid -free soldering
・ Handed paste or pre -form (foil) can be used
・ Flux -free soldering due to reduction
・ Flux recovery function
・ A unique profile can be used for each product
・ Process temperature up to 400 ° C
・ The control of the temperature gradient is possible
・ Short cycle time
・ Separated soldering and cooling chamber
・ Inactive gas atmosphere
・ Remaining oxygen concentration is 5 ppm or less
・ Reddown with high reproducibility is possible
·traceability
・ Continuous process control
・ Insernet interface
・ Remote maintenance (VPN)
・ Smema interface
・ Power saving design
・ ICON ADVANTAGES
・ Modular expansion by customer requests and add -on functions can be quickly realized (eg, processing process)
・ Easy to maintain and operate
·Quick delivery
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