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The SCM5H00 (HTC PEEK) is a cutting material for which PEEK high heat conduction grade (insulation) is compressed by the PBI method. ■ Features of SCM5H00 ・ Share method: PBI method (compressed molding) ・ High thermal conductivity ・ Thermal conductivity: Realizes 10 times or more heat conductivity compared to normal resin materials (5W/m/k or more) ・ Insulation: surface resistance = 10^13Ω or more ・ Water absorption: Low water absorption rate and exert excellent dimensional stability Please contact us for details of the base material size.
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Bending elasticity rate
Bending strength
Glass transfer temperature (TG)
Hammer material size shape
Homber size thickness (mm)
Line expansion rate
Maternal material size angle (mm)
Mother material size MOQ/SPQ
Notch with a notch with a shock strength
Surface resistance value
Tensile strength
Tenstration destroyed strain
Water absorption rate
Part Number
SCM5H00Handling Company
PBI Advanced Materials Co., Ltd.Categories
| Image | Price (excluding tax) | Bending elasticity rate | Bending strength | Glass transfer temperature (TG) | Notch with a notch with a shock strength | Surface resistance value | Tensile strength | Tenstration destroyed strain | Water absorption rate |
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Available upon quote | 17GPa (Condition: 23 ° C, Standard: ISO 178) | 65MPa (Condition: 23 ° C, Standard: ISO 178) | ~ 140 ° C (standard: DSC) | 1.0kj/m^2 (Condition: 23 ° C, Standard: ISO 179) | > 10^13Ω (Condition: 23 ° C, Standard: ANSI/ESD STM11.13) | 40MPa (Condition: 23 ° C, Standard: ISO 527) | 0.3% (Condition: 23 ° C, Standard: ISO 527) | 0.02% (Condition: 23 ° C, 24hr, Standard: ISO 62) |
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