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The SCM5130 is a cutting material for peek fine processing grade (antistatic) compressed and molded by the PBI method. ■ Features of SCM5130 ・ Share method: PBI method (compressed molding) ・ Prevention / conductivity ・ Easy to remove after processing and can be finely processed after processing. ・ ESD characteristics: Even narrow pitch products (thin meat parts) realize stable -appliances prevention effects on the sound: 10^6 --10^10 ω ・ Wearing resistance: Excellent wear resistance, low level of wear powder. ・ Low water absorption: Low water absorption rate, stable electrical characteristics and dimensions ・ Gray: Easy to identify with black IC chips
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Bending elasticity rate
Bending strength
Glass transfer temperature (TG)
Hammer material size shape
Homber size thickness (mm)
Line expansion rate
Maternal material size angle (mm)
Mother material size MOQ/SPQ
Notch with a notch with a shock strength
Surface resistance value
Tensile strength
Tenstration destroyed strain
Water absorption rate
Part Number
SCM5130Handling Company
PBI Advanced Materials Co., Ltd.Categories
| Image | Price (excluding tax) | Bending elasticity rate | Bending strength | Glass transfer temperature (TG) | Hammer material size shape | Homber size thickness (mm) | Line expansion rate | Maternal material size angle (mm) | Mother material size MOQ/SPQ | Notch with a notch with a shock strength | Surface resistance value | Tensile strength | Tenstration destroyed strain |
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Available upon quote | 8.0GPa (Condition: 23 ° C, Standard: ISO 178) | 130MPa (Condition: 23 ° C, Standard: ISO 178) | ~ 140 ° C (standard: DSC) | Plate | 5,10,15 | 38ppm/℃ (Condition: <tg, Standard: JIS K7197) | 305 | 1/1 | 1.5kj/m^2 (Condition: 23 ° C, Standard: ISO 179) | 10^6 --10^10Ω (Condition: 23 ° C, Standard: ANSI/ESD STM11.13) | 90MPa (Condition: 23 ° C, Standard: ISO 527) | 1.5% (Condition: 23 ° C, Standard: ISO 527) |
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