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The SCM5100-50 (Silver Peek50) is a cutting material for compressed and molded PBI methods for PEEK fine-tuning grades (antistatic). ■ Features of SCM5100-50 ・ Share method: PBI method (compressed molding) ・ Prevention / conductivity ・ Mechanical characteristics: high elasticity rate ・ Easy to remove after processing and can be finely processed after processing. ・ ESD characteristics: Even narrow pitch products (thin partial parts), a stable antistatic effect is realized: 10^9 --10^12 ω ・ Wearing resistance: Excellent wear resistance, low level of wear powder. ・ Low water absorption: Low water absorption rate, stable electrical characteristics and dimensions ・ Gray color: Easy to identify with black IC chips Please contact us for details of the base material size.
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Bending elasticity rate
Bending strength
Glass transfer temperature (TG)
Hammer material size shape
Homber size thickness (mm)
Line expansion rate
Maternal material size angle (mm)
Mother material size MOQ/SPQ
Notch with a notch with a shock strength
Surface resistance value
Tensile strength
Tenstration destroyed strain
Water absorption rate
Part Number
SCM5100-50Handling Company
PBI Advanced Materials Co., Ltd.Categories
| Image | Price (excluding tax) | Bending elasticity rate | Bending strength | Glass transfer temperature (TG) | Line expansion rate | Notch with a notch with a shock strength | Surface resistance value | Tensile strength | Tenstration destroyed strain | Water absorption rate |
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Available upon quote | 15GPa (Condition: 23 ° C, Standard: ISO 178) | 150MPa (Condition: 23 ° C, Standard: ISO 178) | ~ 140 ° C (standard: DSC) | 26ppm/℃ (Condition: <tg, Standard: JIS K7197) | 1.5kj/m^2 (Condition: 23 ° C, Standard: ISO 179) | 10^9 --10^12Ω (Condition: 23 ° C, Standard: ANSI/ESD STM11.13) | 90MPa (Condition: 23 ° C, Standard: ISO 527) | 1.0% (Condition: 23 ° C, Standards: ISO 527) | 0.10% (Condition: 23 ° C, 24hr, Standard: ISO 62) |
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