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Price (excluding tax)
■ PBI for semiconductor manufacturing process for natural grade cutting SCM7000HP is a cut -out material that contains PBI low -metal, compressed low -out gas grade by compressed and molded PBI method. ■ Features of SCM7000HP ・ Base resin: PBI ・ Share method: PBI method (compressed molding) ・ Wearing resistance ・ High purity: Low metal containing, low out gas ・ Mechanical characteristics: High strength and high hardness ・ Heat characteristics: Ultra -heat -resistant, low -inflation rate and low heat conduction ・ Energy resistance: Good plasma resistance
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Bending elasticity rate
Bending strength (Condition: 23 ° C, Standard: ISO 178)
Glass transfer temperature (TG) (standard: DSC)
Hammer material size shape
Homber size thickness (mm)
Line expansion rate
Maternal material size angle (mm)
Mother material size MOQ/SPQ
Notch with a notch with a shock strength
Surface resistance value
Tensile intensity (Condition: 23 ° C, Standard: ISO 527)
Tenstration destroyed strain
Water absorption rate
Part Number
SCM7000HPHandling Company
PBI Advanced Materials Co., Ltd.Categories
| Image | Price (excluding tax) | Bending elasticity rate | Bending strength (Condition: 23 ° C, Standard: ISO 178) | Glass transfer temperature (TG) (standard: DSC) | Hammer material size shape | Homber size thickness (mm) | Line expansion rate | Maternal material size angle (mm) | Mother material size MOQ/SPQ | Notch with a notch with a shock strength | Surface resistance value | Tensile intensity (Condition: 23 ° C, Standard: ISO 527) | Tenstration destroyed strain | Water absorption rate |
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Available upon quote | 6.5GPa (Condition: 23 ° C, Standard: ISO 178) | 220MPa | ~ 420 ℃ | Plate | 10,20,30,40,50 | 23ppm/℃ (Condition: <tg, Standard: JIS K7197) | 305 | 1/1 | 4.0kj/m^2 (Condition: 23 ° C, Standard: ISO 179) | > 10^13Ω (Condition: 23 ° C, Standard: ANSI/ESD STM11.13) | 160MPa | 3.0% (Condition: 23 ° C, Standard: ISO 527) | 0.40% (Condition: 23 ° C, 24hr, Standard: ISO 62) |
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