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  2. Semiconductor Manufacturing
  3. Flip Chip Bonders
  4. Tabletop flip chip bonder M90 for research and development
  5. M90
Tabletop flip chip bonder M90 for research and development-HiSOL,Inc.

M90 | Tabletop flip chip bonder M90 for research and development
HiSOL,Inc.

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HiSOL,Inc.'s Response Status

Response Rate

100.0%

Response Time

28.6hours

Relatively Fast Response

Model Filter

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Alignment

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Function

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  • Part Number

    M90

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Tabletop flip chip bonder M90 for research and development M90's performance table

Image Price (excluding tax) Alignment Alignment accuracy Applied load Function
Tabletop flip chip bonder M90 for research and development-Part Number-M90 Available upon quote Manual ±2.5μm 50-2,000g Manual type FC bonder

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About Company Handling This Product

HiSOL,Inc.

Response Rate

100.0%

Response Time

28.6hrs

Company Overview

Hisol Inc., established in 1967 as Kan Electronics, is a manufacturer based in Tokyo, Japan, producing machine...

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  • Japan

Category of this product

Flip Chip Bonders

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