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  2. Semiconductor Manufacturing
  3. Flip Chip Bonders
  4. Auto flip chip bonder MODEL-400
  5. M400TR
Auto flip chip bonder MODEL-400-HiSOL,Inc.

M400TR | Auto flip chip bonder MODEL-400
HiSOL,Inc.

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  • Part Number

    M400TR

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Auto flip chip bonder MODEL-400 M400TR's performance table

Image Price (excluding tax) Alignment Alignment accuracy Applied load Function Type
Auto flip chip bonder MODEL-400-Part Number-M400TR Available upon quote Automatic ±5μm 50-1,000g Fully automatic wafer → chip tray Adhesive tray → device-specific tray etc. Automatic chip transfer machine

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About Company Handling This Product

HiSOL,Inc.

Company Overview

Hisol Inc., established in 1967 as Kan Electronics, is a manufacturer based in Tokyo, Japan, producing machine...

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  • Japan

Category of this product

Flip Chip Bonders

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