All Categories

History

  1. Metoree
  2. Semiconductor Manufacturing
  3. Flip Chip Bonders
  4. Auto flip chip bonder MODEL-400
  5. M400α
Auto flip chip bonder MODEL-400-HiSOL,Inc.

M400α | Auto flip chip bonder MODEL-400
HiSOL,Inc.

Price (excluding tax)

Estimate Required

Model Filter

You can search for other models from each index. The displayed value is the value of the currently selected part number.

Alignment

Alignment accuracy

Applied load

Function

Type

See all 2 models in list

  • Part Number

    M400α

Share this product


320+ people viewing

Last viewed: 22 hours ago

Free
Get started with our free quotation service - no cost, no obligation.

No Phone Required
We respect your privacy. You can receive quotes without sharing your phone number.

Auto flip chip bonder MODEL-400 M400α's performance table

Image Price (excluding tax) Alignment Alignment accuracy Applied load Function Type
Auto flip chip bonder MODEL-400-Part Number-M400α Available upon quote Automatic ±2.5μm 50-1,000g Fully automatic bonding or Manual alignment by JOG feed Automatic flip chip bonder

There are 2 models for this product.

Customers who viewed this product also viewed

Reviews shown here are reviews of companies.

Flip chip bonder YSB55w-Yamaha Robotics Holdings Co., Ltd.

Flip chip bonder YSB55w

Yamaha Robotics Holdings Co., Ltd.

190+ people viewing

Response time: 39.31 hours

Flip Chip Bonders
Flip chip bonder for small devices AFM-15-PFA Co., Ltd.

Flip chip bonder for small devices AFM-15

PFA Co., Ltd.

2780+ people viewing

Last viewed: 1 hour ago

Response time: 92.87 hours

Flip Chip Bonders

6 models listed

Ultra-high precision die bonder with advanced pickup function SPA-1000-Yamaha Robotics Holdings Co., Ltd.

Ultra-high precision die bonder with advanced pickup function SPA-1000

Yamaha Robotics Holdings Co., Ltd.

1010+ people viewing

Last viewed: 5 hours ago

Response time: 39.31 hours

Flip Chip Bonders

2 models listed

High-speed, high-precision small chip die bonder STC-800-Yamaha Robotics Holdings Co., Ltd.

High-speed, high-precision small chip die bonder STC-800

Yamaha Robotics Holdings Co., Ltd.

320+ people viewing

Response time: 39.31 hours

Flip Chip Bonders

2 models listed

Manual flip chip placement system Model 850 with excellent ease of use and positioning accuracy-Hugle Electronics Co., Ltd.

Manual flip chip placement system Model 850 with excellent ease of use and positioning accuracy

Hugle Electronics Co., Ltd.

5.0

150+ people viewing

Response time: 43.71 hours

Flip Chip Bonders

2 models listed

Perform eutectic, ultrasonic, epoxy, thermocompression, and solder flip bonding in one system Flip Chip Bonder Model 865-Hugle Electronics Co., Ltd.

Perform eutectic, ultrasonic, epoxy, thermocompression, and solder flip bonding in one system Flip Chip Bonder Model 865

Hugle Electronics Co., Ltd.

5.0

210+ people viewing

Response time: 43.71 hours

Flip Chip Bonders

3 models listed

Tabletop manual ball wire & bump bonder MODEL-7700D-HiSOL,Inc.

Tabletop manual ball wire & bump bonder MODEL-7700D

HiSOL,Inc.

370+ people viewing

Last viewed: 15 hours ago

Response time: 26.74 hours

Flip Chip Bonders

4 models listed

Ultra-high precision mounting machine flip chip bonder M1300-HiSOL,Inc.

Ultra-high precision mounting machine flip chip bonder M1300

HiSOL,Inc.

240+ people viewing

Response time: 26.74 hours

Flip Chip Bonders
Tabletop flip chip bonder M90 for research and development-HiSOL,Inc.

Tabletop flip chip bonder M90 for research and development

HiSOL,Inc.

340+ people viewing

Last viewed: 16 hours ago

Response time: 26.74 hours

Flip Chip Bonders

2 models listed

WSB2 Wafer bonding equipment WSB2 Wafer bonder 1WBS7 (6 inch type)-HiSOL,Inc.

WSB2 Wafer bonding equipment WSB2 Wafer bonder 1WBS7 (6 inch type)

HiSOL,Inc.

110+ people viewing

Last viewed: 9 hours ago

Response time: 26.74 hours

Flip Chip Bonders

3 models listed

Wafer bonding equipment WSB2 Wafer bonder 1WBS2 (4 inch type)-HiSOL,Inc.

Wafer bonding equipment WSB2 Wafer bonder 1WBS2 (4 inch type)

HiSOL,Inc.

150+ people viewing

Last viewed: 19 hours ago

Response time: 26.74 hours

Flip Chip Bonders

3 models listed

Die bonder tabletop manual eutectic die bonder (6 types collet type) model 7327C-HiSOL,Inc.

Die bonder tabletop manual eutectic die bonder (6 types collet type) model 7327C

HiSOL,Inc.

170+ people viewing

Response time: 26.74 hours

Flip Chip Bonders
See More Flip Chip Bonders Products

Other products of HiSOL,Inc.

Reviews shown here are reviews of companies.

Probe card-HiSOL,Inc.

Probe card

HiSOL,Inc.

240+ people viewing

Last viewed: 3 hours ago

Response time: 26.74 hours

Probe Cards

2 models listed

Atmospheric pressure lamp annealing equipment RTP/RTA 8 inch compatible AccuThermo AW820M-HiSOL,Inc.

Atmospheric pressure lamp annealing equipment RTP/RTA 8 inch compatible AccuThermo AW820M

HiSOL,Inc.

170+ people viewing

Last viewed: 4 hours ago

Response time: 26.74 hours

Annealing Furnaces
IC socket burn-in test-HiSOL,Inc.

IC socket burn-in test

HiSOL,Inc.

180+ people viewing

Last viewed: 2 hours ago

Response time: 26.74 hours

BGA Scokets

2 models listed

Capillary for ball bonding-HiSOL,Inc.

Capillary for ball bonding

HiSOL,Inc.

190+ people viewing

Last viewed: 7 hours ago

Response time: 26.74 hours

Capillaries

3 models listed

Tabletop UV curing furnace lamp type UV PITARI-HiSOL,Inc.

Tabletop UV curing furnace lamp type UV PITARI

HiSOL,Inc.

190+ people viewing

Response time: 26.74 hours

Ultraviolet (UV) Dryers

2 models listed

Measuring Instruments/Measuring Systems Ellipsometer-HiSOL,Inc.

Measuring Instruments/Measuring Systems Ellipsometer

HiSOL,Inc.

190+ people viewing

Response time: 26.74 hours

Ellipsometers
Laser microprocessing equipment-HiSOL,Inc.

Laser microprocessing equipment

HiSOL,Inc.

180+ people viewing

Response time: 26.74 hours

Microfabrication Machines
Tabletop multi-wire bonder (ball & wedge type) MODEL-7KE-HiSOL,Inc.

Tabletop multi-wire bonder (ball & wedge type) MODEL-7KE

HiSOL,Inc.

290+ people viewing

Response time: 26.74 hours

Semiconductor Manufacturing Equipment Component & Part Machining

3 models listed

Desktop manual wedge bonder E series-HiSOL,Inc.

Desktop manual wedge bonder E series

HiSOL,Inc.

260+ people viewing

Response time: 26.74 hours

Wire Bonders
Tabletop manual deep access wedge bonder MODEL-7476D (7600D specification)-HiSOL,Inc.

Tabletop manual deep access wedge bonder MODEL-7476D (7600D specification)

HiSOL,Inc.

290+ people viewing

Response time: 26.74 hours

Wire Bonders
Die Bonder Epoxy Die Bonder Model 7200CR-HiSOL,Inc.

Die Bonder Epoxy Die Bonder Model 7200CR

HiSOL,Inc.

180+ people viewing

Last viewed: 6 hours ago

Response time: 26.74 hours

Flip Chip Bonders
Auto flip chip bonder MODEL-400-HiSOL,Inc.

Auto flip chip bonder MODEL-400

HiSOL,Inc.

320+ people viewing

Last viewed: 22 hours ago

Response time: 26.74 hours

Flip Chip Bonders

2 models listed


View more products of HiSOL,Inc.

About Company Handling This Product

HiSOL,Inc.

Company Overview

Hisol Inc., established in 1967 as Kan Electronics, is a manufacturer based in Tokyo, Japan, producing machine...

See More

  • Japan

Category of this product

Flip Chip Bonders

This is the version of our website addressed to speakers of English in the United States. If you are a resident of another country, please select the appropriate version of Metoree for your country in the drop-down menu.

Copyright © 2025 Metoree