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Copper plating (μm)
Density (g/cm3)
Electrical conductivity (mS/m)
Nickel plating (μm)
Silver plating (μm)
Thermal conductivity (W/m·K)
Thermal expansion coefficient (×10^-6/K)
Titanium plating (μm)
Volume fraction (Vol%)
Part Number
Spacer (AlSiC)Handling Company
Toyominato Co., Ltd.| Image | Price (excluding tax) | Copper plating (μm) | Density (g/cm3) | Electrical conductivity (mS/m) | Nickel plating (μm) | Silver plating (μm) | Thermal conductivity (W/m·K) | Thermal expansion coefficient (×10^-6/K) | Titanium plating (μm) | Volume fraction (Vol%) |
|---|---|---|---|---|---|---|---|---|---|---|
|
|
Available upon quote | 20~30 | 2.93 ± 0.03 | >6 | 8~12 | 4~8 | 200 ± 20 | 9~11 | <0.5 | 55~65 |
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