Sanko Shokai Co., Ltd.'s Surface Treatment Chemicals

■Product overview Spray cleaning and rust preventive agent. ■Features Liquid weak alkaline type (PRTR compatible).

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■Product overview Degreaser for stainless steel. ■Applications For stainless steel. ■Features It is a liquid slightly alkaline type.

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■Product overview Degreasing agent for magnetic alloys. ■Applications For magnetic alloys. ■Features There is no discoloration of the base material.

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■Product overview Alkaline degreaser for copper and copper alloys. ■Applications For copper and copper alloys. ■Features It has strong degreasing...

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■Product overview Tin/tin alloy. ■Applications Discoloration inhibitor for Sn and Sn alloys. ■Features Excellent in preventing discoloration afte...

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■Product overview Chemical polishing agent for 42 alloy and Kovar. ■Applications For 42 alloy Kovar. ■Features It has excellent gloss and levelin...

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■Product overview Chemical polishing agent for steel. ■Applications For steel. ■Features Ideal for deburring and smoothing.

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■Applications Surface treatment agent. ■Features Pale yellowish brown to reddish brown liquid.

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■Product overview Acid cleaning (soaking). ■Applications Immersion cleaning. ■Features Great for degreasing and derusting of steel, copper and co...

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■Product overview Acid cleaning (electrolytic). ■Applications Electrolytic cleaning. ■Features Acid electrolytic cleaning for steel, removing str...

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■Product overview Acid cleaning (electrolytic). ■Applications Electrolytic cleaning. ■Features Acidic electrolytic cleaning for steel, 1-componen...

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■Product overview Printed circuit boards, package boards. ■Applications For copper wiring. ■Features Mild acidic, standard cleaner.

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■Product overview Printed circuit boards, package boards. ■Applications For copper wiring. ■Features A mildly alkaline cleaner that emphasizes th...

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■Product overview "Actee" is a tin/cobalt alloy plating solution that produces a unique bluish black film with good coverage, uniform color tone, a...

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■Product overview Brightener for bright nickel plating. ■Applications Brightener for high leveling. ■Features It has high leveling effect and exc...

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■Product overview Brightener for semi-bright nickel plating. ■Applications Anti-pitting agent. ■Features Excellent pit prevention effect and less...

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■Product overview Brightener for semi-bright nickel plating. ■Applications Non-coumarin, non-formalin. ■Features Excellent work environment, low ...

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■Product overview Brightener for semi-bright nickel plating. ■Applications Non-coumarin, non-formalin. ■Features The film has excellent potential...

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■Product overview Pre-plating copper etching stabilizer. ■Applications Hydrogen peroxide-sulfuric acid based copper etchant. ■Features Forms a sh...

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■Product overview Jig copper plating peeling stabilizer. ■Applications Hydrogen peroxide-sulfuric acid based copper etchant. ■Features High-speed...

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■Product overview Jig copper plating peeling stabilizer. ■Applications Hydrogen peroxide-sulfuric acid based copper etchant. ■Features You can ta...

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■Product overview Pre-plating copper etching stabilizer. ■Applications Hydrogen peroxide-sulfuric acid based copper etchant. ■Features Smoothes u...

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■Product overview Alkaline palladium ion catalyst activator. ■Applications Electroless copper pretreatment. ■Features No pre-dip process required.

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■Product overview Alkaline palladium ion catalyst activator. ■Applications Electroless copper pretreatment. ■Features Low temperature type.

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■Product overview Alkaline palladium ion catalyst predip. ■Applications Electroless copper pretreatment. ■Features Pre-dip for ALCUP MAT-SP.

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■Product overview Antioxidant. ■Applications Tin/tin alloy plating. ■Features Antioxidant for tin and tin alloy plating. Just immersion suppresse...

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■Product overview A treatment agent that is used just before drying in various metal surface treatments to prevent metal oxidation during the dryin...

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■Product overview Pickling liquid additive. ■Applications Inhibitor for pickling (hydrochloric acid). ■Features - Demonstrates stable performance...

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■Product overview For steel substrates. ■Applications For immersion cleaning. ■Features It has strong cleaning power and can be used for a long p...

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■Product overview For steel substrates. ■Applications For immersion cleaning. ■Features To quickly remove mineral oils such as buff scum and pres...

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■Product overview General purpose cleaning agent. ■Applications For immersion cleaning. ■Features Immersion cleaning agent for nonferrous metals ...

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■Product overview For general metals. ■Applications For immersion cleaning. ■Features For general metals that can contribute to energy saving at ...

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■Product overview General purpose cleaning agent. ■Applications For immersion cleaning. ■Features Immersion cleaning agent for nonferrous metals ...

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■Applications Gold sealing agent. ■Features Immersion type, water soluble and has excellent liquid stability.

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■Product overview ・Aurobase: Cyan-based pure gold type, cyan-based alloy type. ・Auro Seed: Cyan type strike. ・Eco Gold: Non-cyanide pure gold an...

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■Product overview Printed circuit boards, package boards. ■Applications For copper wiring. ■Features Sulfuric acid type activator for copper circ...

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■Product overview Printed circuit boards, package boards. ■Applications For copper wiring. ■Features Sulfuric acid type activator for copper circ...

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■Product overview ceramic substrate. ■Applications For ceramics. ■Features Neutral activator for tungsten and molybdenum. Excellent adhesion.

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■Product overview ceramic substrate. ■Applications For ceramics. ■Features Neutral activator for silver paste. Excellent adhesion.

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■Product overview ceramic substrate. ■Applications For ceramics. ■Features When used in combination with Axemalta MPD-22, it suppresses plating p...

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■Product overview Printed circuit boards, package boards. ■Applications For copper wiring. ■Features Chlorine type activator for copper circuits....

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■Product overview Printed circuit boards, package boards. ■Applications For copper wiring. ■Features Post-dip for copper circuits. Excellent fine...

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■Applications Zinc die casting chemical polishing agent. ■Features The luster and coverage of the plating on zinc die-casting. Significantly impro...

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■Applications Zinc die casting chemical polishing agent. ■Features Non-chelate type with extremely good drainage properties, chemical polishing an...

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■Product overview Nickel plating - barrier layer. ■Applications Plating chemicals for semiconductor wafers. ■Features Low stress, good film prope...

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■Applications Decorative copper sulfate brightener. Decorative plating on plastic and metal materials. ■Features The plating deposition rate is fa...

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■Product overview Copper sulfate plating - for rewiring and bumps. ■Applications Plating chemicals for semiconductor wafers. ■Features Glossy typ...

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■Applications Chemical polishing agent for steel. ■Features Chemical polishing agent for steel. Applicable for polishing and deburring materials. ...

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■Product overview etching. ■Applications Plating chemicals for electronic parts - Etching. ■Features For Corson copper alloy, electrolytic type, ...

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■Product overview Additive for alloy plating. ■Applications Copper-tin alloy plating for barrel. ■Features ・Cyanide-free acidic copper-tin alloy...

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■Product overview Processing chemicals for plastic plating. ■Applications Catalyst imparting agent. ■Features Excellent stability and improved po...

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■Product overview Processing chemicals for plastic plating. ■Applications Catalyst imparting agent. ■Features Compatible with PC/ABS alloy. Less ...

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■Product overview Processing chemicals for plastic plating. ■Applications Catalyst imparting agent. ■Features Improve catalyst stability by suppl...

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■Product overview Plating on plastics. ■Features This is a process that chemically deposits copper with good adhesion onto the surface of plastic....

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■Product overview Stanalloy® process. ■Applications Alloy plating (for decoration). ■Features Copper/tin alloy plating produces a gorgeous pinkis...

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■Product overview etching. ■Applications Plating chemicals for electronic parts - Etching. ■Features For copper and copper alloys, immersion type...

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■Product overview Chemical abrasive. ■Applications Chemical abrasive. ■Features For copper and copper alloys, sulfuric acid type makes wastewater...

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■Product overview Chemical abrasive. ■Applications Chemical abrasive. ■Features Scale remover for copper and copper alloys.

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■Product overview Stanalloy® process. ■Applications Alloy plating (for decoration). ■Features Tin-cobalt alloy plating with a color similar to ch...

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■Product overview Applicable to most general decorative plating and final finish plating of standard parts that require thickness, corrosion resist...

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■Product overview Molds, rolls, tools, mechanical parts/sliding parts such as shafts and cylinders, seawater resistant and environmentally friendly...

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■Product overview Applicable to most general decorative plating and final finish plating of standard parts that require thickness, corrosion resist...

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■Applications Catalyst, metal surface treatment. ■Features Blue liquid.

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■Applications Metal surface treatment. ■Features green liquid.

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■Applications Plating, dye, metal surface treatment. ■Features Blue-green liquid.

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■Product overview The Clean Etch CPB series is a chemical polishing liquid for copper and copper alloys that is effective for smoothing, brightenin...

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■Product overview ・Clean etch TCP-08, TCP-09, chemical polishing liquid for smoothing and brightening titanium and titanium alloys. ・Clean Etch T...

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■Product overview Alkaline electrolytic degreaser. ■Applications Electrolytic degreasing. ■Features An alkaline degreaser that can be used on bot...

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■Product overview Printed circuit boards, package boards. ■Applications For copper wiring. ■Features Acidic, fine pattern cleaner for preventing ...

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■Product overview Printed circuit boards, package boards. ■Applications For copper wiring. ■Features A cleaner for selective plating using dry fi...

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■Product overview Printed circuit boards, package boards. ■Applications For copper wiring. ■Features Cleaner compatible with acidic and high aspe...

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■Product overview cleaner conditioner. ■Applications Electroless copper pretreatment. ■Features Compatible with SAP/MSAP.

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■Product overview Treatment chemicals for aluminum and aluminum alloys - Degreasing agents and buffing residue removers. ■Applications Acidic buff...

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■Product overview Processing chemicals for plastic plating. ■Applications Surface conditioner. ■Features Greatly improves catalyst adsorption abi...

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■Product overview Processing chemicals for plastic plating. ■Applications Surface conditioner. ■Features Adjust the surface after etching to impr...

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■Product overview Solvent diluted type, anti-rust oil, strong anti-rust oil with seawater displacement. ■Applications Thin-film, seawater-resistan...

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■Product overview Solvent diluted type, anti-rust oil, multi-purpose anti-rust oil. ■Applications A versatile, multi-purpose anti-rust oil that fo...

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■Applications Surface treatment agent, resin curing agent. ■Features Pale reddish-purple lumps.

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■Product overview Cleaning agent for optical lenses and prisms. ■Applications For optical lenses and prisms. ■Features Excellent cleaning and wat...

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■Product overview Peeling cleaning agent for optical lenses and liquid crystal glass. ■Applications Optical lenses and liquid crystal glass. ■Fea...

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■Product overview Via filling copper sulfate plating. ■Applications Plating chemicals for printed wiring boards - SAP/MSAP compatible processes. ...

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■Product overview Via filling copper sulfate plating. ■Applications Plating chemicals for printed wiring boards. ■Features Filled plating.

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■Product overview Pretreatment agent for aluminum and aluminum alloys. ■Features Hard alumite additive for aluminum die casting. No special equipm...

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■Product overview Pretreatment agent for aluminum and aluminum alloys. ■Features Hard alumite additive for aluminum die casting. No special equipm...

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■Product overview Immersion/electrolytic degreaser. ■Applications Press/processing oil degreaser. ■Features ・Strong degreasing power due to the ...

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■Product overview Immersion/electrolytic degreaser. ■Applications Degreasing agent for reel to reel and hoop plating. ■Features ・The effect of s...

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■Product overview Dipsol #07 is an alkaline degreaser for spraying iron, copper, zinc, and aluminum, and is an excellent degreaser that can be used...

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■Product overview DIPSOL #142 is a nonionic surfactant that can be used in a wide range of applications and has excellent performance as a metal de...

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■Product overview Dipsol #160 is a high-performance treatment agent that completely removes oil, rust, and both at the same time, and is the best c...

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■Product overview DIPSOL #186 is an excellent pickling inhibitor for sulfuric acid and hydrochloric acid, which is a combination of various surfact...

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■Product overview Dipsol #424 is a water-soluble anti-tarnishing agent developed by our company to maintain the luster of copper and brass after Ki...

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■Product overview Dip Sole #64 removes stains such as highly viscous lubricating oil, paraffin, abrasives, buff scum, and rust preventive oil that ...

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■Product overview Dip Sole #91 is a convenient cleaning agent that chemically removes dirt (scum) from rubber molds (iron products) with its strong...

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■Product overview Dipsol AC-6 is a high-performance activator that can be used on a variety of materials and for a variety of applications. Used fo...

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■Product overview Dipsol Ag-420Y is an anti-tarnish agent that protects the surfaces of silver, copper and copper alloys from various corrosive gas...

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■Product overview Dip Sole Ag-422Y creates a durable protective film on silver or silver-plated surfaces with a simple dipping process. This film c...

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■Product overview Dipsol Ag-435 easily removes oxide films from discolored silver, tin, copper alloys, etc. ■Applications Removal of tarnish from ...

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■Product overview Dipsol AL-45 is an excellent degreaser for non-ferrous metals such as aluminum, aluminum alloys and aluminum diegast. There is li...

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■Product overview Dip Sole AL-45Add is an etching inhibitor for nonferrous metals such as aluminum, aluminum alloys, and aluminum digast. There is ...

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■Product overview Dipsol AL-45 is an excellent degreaser for non-ferrous metals such as aluminum, aluminum alloys and aluminum die-casting. There i...

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■Product overview By combining degreasing (DS-11) → pickling (DS-21) → electrolytic degreasing (DS-31), it is possible to eliminate the use of nitr...

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■Product overview Dipsol Fe-470D is a blackening agent for steel that can produce an ideal black coating just by soaking it for a short time. This ...

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■Product overview Dipsol I-0415 is a low-temperature, low-foaming powder degreasing cleaning product. It has excellent degreasing and cleaning powe...

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■Product overview Dip Sole's Hynic Process IZ-250Y is a zinc-nickel alloy plating method using an alkaline non-cyanide bath. It has excellent unifo...

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■Product overview Dip Sole's Hynic Process IZ-252Y is a zinc-nickel alloy plating method using an alkaline non-cyanide bath. It has excellent unifo...

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■Product overview Dip Sole's Anic Process IZ-260 is a zinc-nickel alloy plating method using an alkaline non-cyanide bath. It has excellent uniform...

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■Product overview Dip Sole's Anic Process IZ-262 is a zinc-nickel alloy plating method using an alkaline non-cyanide bath. It has excellent uniform...

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■Product overview Dipsol IZ-264T type is a colorless trivalent chromium conversion treatment agent that does not use hexavalent chromium. ■Applica...

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■Applications High nickel eutectoid, zinc-nickel alloy plating brightener. (low hydrogen embrittlement) ■Features ・Low hydrogen embrittlement. (E...

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■Product overview DIPSOL NZ-110 is a type of brightener that has a smaller difference in film thickness due to current density than the conventiona...

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■Product overview DIPSOL NZ-110R is an ultra-uniform electrodeposition type brightener that has a smaller film thickness difference due to current ...

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■Product overview Dipsol NZ-200 is a type of brightener that is more compatible with trivalent chromium chemical conversion treatment than conventi...

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■Product overview DIPSOL NZ-71 is a new type of brightener for the era of high functionality that provides high-speed zincate that cannot be obtain...

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■Product overview Dipsol NZ-750 is a new type of zincate bath high-speed barrel galvanizing brightener that achieves high-speed plating that ensure...

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■Product overview Dip Sole NZ-77 has a clean and bright plating appearance, and has excellent finish and secondary processability. The bath has a s...

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■Product overview DIPSOL NZ-98 is a new type of brightener for the highly functional era, with excellent uniform electrodeposition that cannot be o...

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■Product overview In rack plating, are you having problems with plating not being deposited on some parts of deep-drawn pressed products, or with p...

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■Product overview Dipsol SZ-240 is a tin-zinc alloy plating agent that we were the first in the world to successfully commercialize in 1975. Since ...

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■Product overview Dipsol SZ-242 is a tin-zinc alloy plating agent that we were the first in the world to successfully commercialize in 1975. Since ...

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■Product overview DIPSOL SZ-247 is a trivalent chromium conversion treatment agent for Sn-Zn alloy plating. A colorless or extremely pale yellow fi...

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■Product overview Added to inorganic acids, it is used as a removal additive when pickling materials with oil, scale, or red rust. In particular, e...

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■Product overview DIPSOL V-8 is a rust removal promoting additive for sulfuric acid pickling that provides the same speed of rust removal as hydroc...

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■Product overview Black dye. ■Applications (Material) Iron. ■Features ・Strong alkaline boiling type iron blackening agent. ・Produces a black f...

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■Product overview Colored for zinc. ■Applications Chemical treatment (chromate). ■Features Colored. F-free, Co-free chemical conversion treatment...

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■Product overview Dual use colored. ■Applications Chemical treatment (chromate). ■Features Colored. F-free chemical treatment. Color tone can be ...

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■Product overview Black chrome plating chemicals. ■Features ・Low-temperature type glossy black chrome plating. ・Ideal for decorative black chrom...

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■Product overview Activator. ■Features A powerful liquid activator. Activation is uniform and plating with good adhesion can be applied. Additiona...

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■Product overview Tin bath for bump formation. ■Applications Tin plated. ■Features Excellent uniform electrodeposition and forms void-free bumps.

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■Product overview Additives are mixed with 85% high purity phosphoric acid. You can use it by adjusting the sulfuric acid concentration. ■Applicat...

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■Product overview Plating on plastic. ■Applications For epoxy. ■Features An excellent plating process for engineering plastics.

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■Product overview Engineering plastics plating (pretreatment). ■Applications For nylon 6/66 and PPE/PA polymer alloys. ■Features An excellent pla...

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■Product overview Engineering plastics plating (pretreatment). ■Applications For PC&PC/ABS alloy. ■Features An excellent plating process for engi...

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■Product overview Engineering plastics plating (pretreatment). ■Applications For polybutylene tereftate. ■Features An excellent plating process f...

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■Product overview Engineering plastics plating (pretreatment). ■Applications For polyacetal. ■Features An excellent plating process for engineeri...

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■Product overview Engineering plastics plating (pretreatment). ■Applications For polypropylene. ■Features An excellent plating process for engine...

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■Product overview Engineering plastics plating (pretreatment). ■Applications For liquid crystal polymer. ■Features An excellent plating process f...

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■Product overview wafer. ■Applications Electroless nickel plating - lead-free Ni-P plating. ■Features Good pattern following plating performance.

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■Product overview Small diameter pad wafers for logic devices, etc. ■Applications Electroless nickel plating - lead-free Ni-P plating. ■Features ...

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■Product overview For pure aluminum or aluminum alloy pads. ■Applications For wafers. ■Features Suppresses the amount of alkaline etching and alu...

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■Product overview For pure aluminum or aluminum alloy pads. ■Applications For wafers. ■Features Can be used with alkaline etching, low etching am...

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■Product overview For pure aluminum or aluminum alloy pads. ■Applications For wafers. ■Features Acid cleaning liquid exclusively for Epitas LEC-40.

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■Product overview For copper pads. ■Applications For wafers. ■Features Mildly acidic conditioner.

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■Product overview For pure aluminum or aluminum alloy pads. ■Applications For wafers. ■Features A slightly alkaline conditioner.

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■Product overview For copper pads. ■Applications For wafers. ■Features Sulfuric acid type palladium activator.

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■Product overview For pure aluminum or aluminum alloy pads. ■Applications For wafers. ■Features ・Alkaline zinc replacement bath. - Reduces spike...

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■Product overview For copper pads. ■Applications For wafers. ■Features Post-dip for copper pads, strong acid type, for fine patterns.

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■Product overview wafer. ■Applications Electroless nickel plating - Ni-P plating. ■Features Good pattern following plating performance.

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■Product overview Small diameter pad wafer. ■Applications Electroless nickel plating - Ni-P plating. ■Features Excellent coating coverage under l...

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■Product overview wafer. ■Applications Electroless palladium plating for wafers. ■Features Electroless palladium bath for Pd-P type ENEPIG that e...

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■Product overview Satin finish agent for stainless steel. ■Applications For stainless steel. ■Features A roughened surface comparable to shot bla...

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■Product overview alkaline liquid. ■Applications Stainless steel filter, recycled cleaning agent. ■Features ・Contains no cyanide, chromium, or p...

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■Product overview alkaline liquid. ■Applications Cleaning agent for synthetic fiber spinnerets (spinning nozzles). ■Features - Possible to wash a...

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■Product overview alkaline liquid. ■Applications Carbon remover for steel. ■Features ・Contains no cyanide, chromium, or phenols. ・Strong penetr...

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■Product overview Soft etching agent. ■Applications Copper surface activator for printed circuit boards and flexible circuit boards. ■Features - ...

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■Product overview Tin plating - for bumps. ■Applications Plating chemicals for semiconductor wafers. ■Features Easy liquid management.

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■Product overview Degreaser. ■Applications Steel, copper alloy, zinc die casting, nickel alloy degreaser. ■Features Can be used for both boiling ...

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■Product overview Degreaser. ■Applications Steel, copper alloy, zinc die casting, nickel alloy degreaser. ■Features ・Since it is a liquid type, ...

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