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Panasonic Industry Co., Ltd.'s Insulating Materials

Panasonic Industry Co., Ltd.

3 products found

Panasonic Industry Co., Ltd.

Semiconductor device materials Liquid materials and adhesives for mounting reinforcement “LEXCM DF” series

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Last viewed: 1 day ago

■Product overview Secondary mounting reinforcement for semiconductor packages such as CSP/BGA, adhesive bonding for camera modules/image sensors T...

Panasonic Industry Co., Ltd.

Semiconductor device materials: Encapsulant “LEXCM CF” series for automotive and industrial equipment

40+ people viewing

Last viewed: 1 day ago

■Product overview Achieving improved reliability of semiconductor packages such as power devices that require automotive quality Power device ■Del...

Panasonic Industry Co., Ltd.

Semiconductor device materials “LEXCM CF” and “LEXCM DF” series, encapsulant materials for advanced semiconductor packages

60+ people viewing

Last viewed: 2 hours ago

■Product overview Improved reliability of advanced semiconductor packages such as wafer level packages, FC CSP/BGA, and Wifi modules WLP/PLP ■Semi...


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