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Nickel plating for bonding / Nickel plating for bonding (MC-03WB)-Nickel plating for bonding (MC-03WB)
Nickel plating for bonding / Nickel plating for bonding (MC-03WB)-Mitsuya Co., Ltd.

Nickel plating for bonding / Nickel plating for bonding (MC-03WB)
Mitsuya Co., Ltd.

Mitsuya Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

9.8hours

Fast Response


About This Product

Wire bonding is a method of connecting electrodes on transistors and integrated circuits to electrodes on printed circuit boards and semiconductor packages using thin wires made of gold, aluminum, copper, etc. Aluminum wire bonding is used in power semiconductors that are currently widely used. Therefore, the plating used on the surfaces connected by wire bonding requires reliability in terms of bonding strength. Previously, electroless nickel plating was mainly used for its reliability in bonding strength, but Mitsuya has achieved the same or better performance with electrolytic nickel plating. With the nickel plating compatible with high-frequency bonding for aluminum wire developed by Mitsuya, there have been no bonding defects for over 10 years. This has contributed to significant cost reductions by reducing the defective rate during mounting. Additionally, although it can be processed using either racks or hoops, changing to the hoop method has enabled mass production and has a proven track record of reducing costs by 85%.

■Functional characteristics

・Corrosion resistance ・Wire bonding ・Good solder・Good bondability

■Industrial field used

・Automobile-IGBT ·car

  • Product

    Nickel plating for bonding / Nickel plating for bonding (MC-03WB)

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1 Models of Nickel plating for bonding / Nickel plating for bonding (MC-03WB)

Image Part Number Price (excluding tax) Processing method Base plating type
Nickel plating for bonding / Nickel plating for bonding (MC-03WB)-Part Number-Nickel plating for bonding (MC-03WB)

Nickel plating for bonding (MC-03WB)

Available upon quote

B,R,M,H
*B: Barrel R: Rack M: Netting H: Hoop

Cu

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About Company Handling This Product

Response Rate

100.0%


Response Time

9.8hrs

  • Japan

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