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Gold-tin alloy plating/gold-tin alloy plating (MC-12GT)-Gold-tin alloy plating (MC-12GT)
Gold-tin alloy plating/gold-tin alloy plating (MC-12GT)-Mitsuya Co., Ltd.

Gold-tin alloy plating/gold-tin alloy plating (MC-12GT)
Mitsuya Co., Ltd.


About This Product

■Functional plating for electronic components

The gold-tin alloy plating has a composition of 80 gold and 20 tin, exhibiting a eutectic point, and a melting point of 280℃. In many cases, gold-tin alloys are created metallurgically, but this is becoming difficult as parts become increasingly finer. The gold-tin alloy plating developed by Mitsuya enables the plating of minute parts and the control of a plating film with a uniform eutectic composition. Therefore, it can be expected to be used as a high-temperature lead-free solder material. ・Thinner film: The thickness of the Au-Sn film can be controlled, allowing for thinner films (with a proven track record of 33% cost reduction). ・Wide range of alloy compositions: The alloy ratio can be changed as desired, allowing a wide range of film compositions (with a track record of Au90-70wt%). ・Highly reliable joining: Good oxidation resistance and solderability, allowing for highly reliable joining. When considering solder joint applications, if an Au film is used for the seed layer, please let us know the details of the specifications in advance.

■Functional characteristics

・Good solder・Good bondability ・High conductivity ・Low contact resistance

■Industrial field used

・Electronic/communication equipment - sensors ·semiconductor

  • Product

    Gold-tin alloy plating/gold-tin alloy plating (MC-12GT)

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1 Models of Gold-tin alloy plating/gold-tin alloy plating (MC-12GT)

Image Part Number Price (excluding tax) Processing method Base plating type
Gold-tin alloy plating/gold-tin alloy plating (MC-12GT)-Part Number-Gold-tin alloy plating (MC-12GT)

Gold-tin alloy plating (MC-12GT)

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B,R
*B: Barrel R: Rack M: Netting H: Hoop

Cu,Ni,Pd-Ni,Ni-P

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