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  2. Electroless gold plating/electroless gold plating (for thin application) (Mitsuya Co., Ltd.)
Electroless gold plating/electroless gold plating (for thin application)-Electroless gold plating (for thin application)
Electroless gold plating/electroless gold plating (for thin application)-Mitsuya Co., Ltd.

Electroless gold plating/electroless gold plating (for thin application)
Mitsuya Co., Ltd.

Mitsuya Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

9.8hours

Fast Response

About This Product

■Functional plating for electronic components

Electroless gold plating (for thin application) is used when it is necessary to apply a thin layer of gold to a nickel surface. The plating thickness is 0.05μm or less. This plating is an electroless plating type, so it can be deposited on independent circuit patterns. The features of Mitsuya's electroless gold plating (for thin plating) are as follows. ・Good solder wettability and solder joint strength ・Can be used at low temperatures (temperature 80℃) ・Less damage to the base nickel ・Achieves a dense and uniform film

■Functional characteristics

・Low contact resistance ・Good solder・Good bondability ・High conductivity

■Industrial field used

・Electronic/communication equipment - sensors ·semiconductor

  • Product

    Electroless gold plating/electroless gold plating (for thin application)

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1 Models of Electroless gold plating/electroless gold plating (for thin application)

Image Part Number Price (excluding tax) Processing method Base plating type
Electroless gold plating/electroless gold plating (for thin application)-Part Number-Electroless gold plating (for thin application)

Electroless gold plating (for thin application)

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R,M
*B: Barrel R: Rack M: Netting H: Hoop

Ni-P

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About Company Handling This Product

Mitsuya Co., Ltd.

Response Rate

100.0%

Response Time

9.8hrs

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