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  2. Electroless gold plating/electroless gold plating (for thick coating) (Mitsuya Co., Ltd.)
Electroless gold plating/electroless gold plating (for thick coating)-Electroless gold plating (for thick coating)
Electroless gold plating/electroless gold plating (for thick coating)-Mitsuya Co., Ltd.

Electroless gold plating/electroless gold plating (for thick coating)
Mitsuya Co., Ltd.

Mitsuya Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

9.8hours

Fast Response

About This Product

■Functional plating for electronic components

Electroless gold plating (for thick applications) is used on isolated circuit patterns where good solderability and low contact resistance are required. Used when thick gold plating is required. The features of Mitsuya's electroless gold plating (for thick plating) are as follows. ・Thick gold plating from 0.1 μm to several μm is possible with stable deposition rate. ・Good fine pattern plating properties ・Can reduce the occurrence of plating discoloration, uneven precipitation, etc. ・Good wire bonding properties This gold plating process causes virtually no damage to the substrate or resist.

■Functional characteristics

・Low contact resistance ・Good solder・Good bondability ・High conductivity

■Industrial field used

・Electronic/communication equipment - sensors ·semiconductor

  • Product

    Electroless gold plating/electroless gold plating (for thick coating)

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1 Models of Electroless gold plating/electroless gold plating (for thick coating)

Image Part Number Price (excluding tax) Processing method Base plating type
Electroless gold plating/electroless gold plating (for thick coating)-Part Number-Electroless gold plating (for thick coating)

Electroless gold plating (for thick coating)

Available upon quote

R,M
*B: Barrel R: Rack M: Netting H: Hoop

Au

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About Company Handling This Product

Mitsuya Co., Ltd.

Response Rate

100.0%

Response Time

9.8hrs

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