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Laser marking/repair system MicroPoint-MicroPoint
Laser marking/repair system MicroPoint-Photonic Instruments Co., Ltd.

Laser marking/repair system MicroPoint
Photonic Instruments Co., Ltd.

Photonic Instruments Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

33.0hours

Relatively Fast Response


About This Product

By introducing laser light into the optical path of the epi-illumination of an optical microscope and focusing it onto the sample using the focusing power of the objective lens, it is possible to easily, safely, accurately, and non-contaminate micro-marking and processing/cutting of micro-areas. It can be done. Can be attached to most microscopes without modification. Basically, the laser is irradiated at the center of the observation field. We are also preparing a system (Character Marker) that can be used in combination with an electric stage to draw patterns and letters, and a system (Wafer Review) that can share defect maps from defect inspection equipment and integrate observation and marking. The control software can be customized to suit your needs.

■Features

- A minute spot close to the diffraction limit can be obtained. (0.3μm or less when using 100X objective) - Laser irradiation is possible at the same time as observation with an eyepiece/digital camera. ・Selective cutting is possible in the depth direction of the sample. - Easy to install and move due to fiber connection method. - Adopts dye laser, wavelength can be changed depending on purpose. (Selectable range: 365nm to 900nm) ・Can mark/process most materials. ・Beam alignment and power adjustment can be easily performed. ・Pulse energy 50μJ or more, pulse width 2-6 nsec. - Laser device equivalent to JIS-C6802 class 1.

■Application

・Laser marking ・Circuit disconnection/repair of semiconductor devices ・Removal of passivation film ・Removal of contamination ・Photomask processing/repair ・Flat panel display repair ・Micromachine processing

■Compatible with most materials

Basically, marking/processing is performed using the 435nm peak wavelength range. With this wavelength alone, silicon wafers, SiC wafers (silicon carbide), sapphire wafers, other compound semiconductor wafers, HDDs, glass, copper (Cu), gold (Au), aluminum (Al), chromium (Cr), nickel (Ni), polyimide, ITO, nitride film, etc. - Can mark all metal and resin materials. Depending on the combination of materials, it is also possible to pass through the upper layer and mark/process the lower layer. Example: Observe from the back side of SiC and mark on the internal pattern. Example: Marking on internal board through LCD glass.

  • Product

    Laser marking/repair system MicroPoint

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1 Models of Laser marking/repair system MicroPoint

Image Part Number Price (excluding tax) Weight Continuous shot stability accuracy Repetition rate Nitrogen gas supply method Wavelength Dimensions (W x H x D) Peak output Pulse width Pulse energy
Laser marking/repair system MicroPoint-Part Number-MicroPoint

MicroPoint

Available upon quote

Cartridge type 3.4 kg
Gas flow type 13 kg

Cartridge type <± 3.5 %
Gas flow type <± 2.5 %

1-20Hz

Cartridge type Cartridge replacement
Gas flow type gas equipment (cylinders and facility piping)

337.1nm

Cartridge type 95 x 95 x 279 mm
Gas flow type 300 x 150 x 580 mm

Cartridge type 45 kW
Gas flow type 330 kW

Cartridge type 4 ns
Gas flow type 0.9 ns (900 ps)

Cartridge type 150 μJ
Gas flow type 300 μJ

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About Company Handling This Product

Response Rate

100.0%


Response Time

33.0hrs

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