Laser marking/repair system MicroPoint
Photonic Instruments Co., Ltd.
About This Product
By introducing laser light into the optical path of the epi-illumination of an optical microscope and focusing it onto the sample using the focusing power of the objective lens, it is possible to easily, safely, accurately, and non-contaminate micro-marking and processing/cutting of micro-areas. It can be done. Can be attached to most microscopes without modification. Basically, the laser is irradiated at the center of the observation field. We are also preparing a system (Character Marker) that can be used in combination with an electric stage to draw patterns and letters, and a system (Wafer Review) that can share defect maps from defect inspection equipment and integrate observation and marking. The control software can be customized to suit your needs.
■Features
- A minute spot close to the diffraction limit can be obtained. (0.3μm or less when using 100X objective)
- Laser irradiation is possible at the same time as observation with an eyepiece/digital camera.
・Selective cutting is possible in the depth direction of the sample.
- Easy to install and move due to fiber connection method.
- Adopts dye laser, wavelength can be changed depending on purpose. (Selectable range: 365nm to 900nm)
・Can mark/process most materials.
・Beam alignment and power adjustment can be easily performed.
・Pulse energy 50μJ or more, pulse width 2-6 nsec.
- Laser device equivalent to JIS-C6802 class 1.
■Application
・Laser marking
・Circuit disconnection/repair of semiconductor devices
・Removal of passivation film
・Removal of contamination
・Photomask processing/repair
・Flat panel display repair
・Micromachine processing
■Compatible with most materials
Basically, marking/processing is performed using the 435nm peak wavelength range. With this wavelength alone, silicon wafers, SiC wafers (silicon carbide), sapphire wafers, other compound semiconductor wafers, HDDs, glass, copper (Cu), gold (Au), aluminum (Al), chromium (Cr), nickel (Ni), polyimide, ITO, nitride film, etc. - Can mark all metal and resin materials. Depending on the combination of materials, it is also possible to pass through the upper layer and mark/process the lower layer.
Example: Observe from the back side of SiC and mark on the internal pattern.
Example: Marking on internal board through LCD glass.
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Product
Laser marking/repair system MicroPoint
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Handling Company
Photonic Instruments Co., Ltd.
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Categories
1 Models of Laser marking/repair system MicroPoint
| Product Image | Part Number | Price (excluding tax) | Continuous shot stability accuracy | Dimensions (W x H x D) | Nitrogen gas supply method | Peak output | Pulse energy | Pulse width | Repetition rate | Wavelength | Weight |
|---|---|---|---|---|---|---|---|---|---|---|---|
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MicroPoint |
Available upon quote |
Cartridge type <± 3.5 % Gas flow type <± 2.5 % |
Cartridge type 95 x 95 x 279 mm Gas flow type 300 x 150 x 580 mm |
Cartridge type Cartridge replacement Gas flow type gas equipment (cylinders and facility piping) |
Cartridge type 45 kW Gas flow type 330 kW |
Cartridge type 150 μJ Gas flow type 300 μJ |
Cartridge type 4 ns Gas flow type 0.9 ns (900 ps) |
1-20Hz | 337.1nm |
Cartridge type 3.4 kg Gas flow type 13 kg |
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