Microchip manipulator
Precise Gauge Co., Ltd.
About This Product
■Summary
Diversified industrial high-mix, low-volume die bonding is on the rise. This system is a small and low-cost microchip assembly system that supports such small-lot production.
Conventional die bonders assemble standard chips, but there are times when it is difficult to handle applications such as mounting irregularly shaped chips onto small modules. This system is equipped with a low-load manipulator head (load on chip: 5g to 10g) on a highly rigid frame, and can mount and fuse chips of 1μm to 2mm in any position with a repeatability of 1μm or less. I will.
■Features
・The PC-sized manipulator has ultimate rigidity and operates stably without a stone surface plate or vibration isolation table, making die bonding possible in the space of one workbench.
-Die bonding repeatability of 1μm is possible.
- Compatible with chip sizes of 100μm to 2mm.
・Chip supply and die bonding are possible within the operating range of φ150mm on the manipulator.
・Supports gold/tin fusion, silver pay fusion, solder fusion, UV adhesion, etc.
・We perform mounting and assembly of LD chips, PD chips, lenses, filters, etc. with 1μm accuracy.
- Since the device is mounted by hand rather than by a suction collet, the mounting status can be confirmed with a high-magnification microscope image.
・Since welding and adhesion are performed while holding the device with hands or pins, the effects of thermal expansion, shrinkage, and curing shrinkage can be minimized.
solution
■Fusion solution
Using pulse heat heating method and high frequency heating method, the chip is heated to over 300℃ in 10 seconds, and gold-tin is fused in about 1 second. Since the hand grips the chip during fusion, it is virtually unaffected by thermal expansion, thermal contraction, etc., making it possible to fusion with 1μm accuracy.
■UV adhesive solution
Precise Gauge's unique know-how eliminates deterioration in mounting accuracy due to heat shrinkage caused by UV irradiation, and enables UV bonding with an accuracy of 1 μm or less.
■Configuration
・Manipulator mechanism part
・SUS standard hand
・Standard objective lens: ×2.5
・Manipulator control unit
・Manipulator control software
・Dedicated PC
・Simple image measurement software
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Product
Microchip manipulator
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Handling Company
Precise Gauge Co., Ltd.
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Categories
1 Models of Microchip manipulator
| Product Image | Part Number | Price (excluding tax) | Amount of movement | Base stage operation | Body rotation | Feed screw pitch | Gripping force sensor | Moving display | Opening/closing operation | Overload resistance | Small XYZ stage operation | Standard finger | Table size | Table size (θ stage) | Travel amount (XY/θ) | Θ microtremor |
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Microchip manipulator |
Available upon quote | ±5mm | Remote electric and manual combination | 180° notch method, manual | 0.5mm | G display compatible | 0.1μm linear scale | Maximum 2mm target opening/closing on one side, remote electric | 1kg | XY: Manual, Z: Remote electric | A pair attached | 30mm | Φ80mm | 150mm/360° | ±3° |
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About Company Handling This Product
- Japan