Microchip manipulator-Microchip manipulator

Microchip manipulator
Precise Gauge Co., Ltd.

About This Product

■SummaryDiversified industrial high-mix, low-volume die bonding is on the rise. This system is a small and low-cost microchip assembly system that supports such small-lot production.

Conventional die bonders assemble standard chips, but there are times when it is difficult to handle applications such as mounting irregularly shaped chips onto small modules. This system is equipped with a low-load manipulator head (load on chip: 5g to 10g) on ​​a highly rigid frame, and can mount and fuse chips of 1μm to 2mm in any position with a repeatability of 1μm or less. I will.

■Features・The PC-sized manipulator has ultimate rigidity and operates stably without a stone surface plate or vibration isolation table, making die bonding possible in the space of one workbench.
-Die bonding repeatability of 1μm is possible.
- Compatible with chip sizes of 100μm to 2mm.
・Chip supply and die bonding are possible within the operating range of φ150mm on the manipulator.
・Supports gold/tin fusion, silver pay fusion, solder fusion, UV adhesion, etc.
・We perform mounting and assembly of LD chips, PD chips, lenses, filters, etc. with 1μm accuracy.
- Since the device is mounted by hand rather than by a suction collet, the mounting status can be confirmed with a high-magnification microscope image.
・Since welding and adhesion are performed while holding the device with hands or pins, the effects of thermal expansion, shrinkage, and curing shrinkage can be minimized.

solution
■Fusion solutionUsing pulse heat heating method and high frequency heating method, the chip is heated to over 300℃ in 10 seconds, and gold-tin is fused in about 1 second. Since the hand grips the chip during fusion, it is virtually unaffected by thermal expansion, thermal contraction, etc., making it possible to fusion with 1μm accuracy.

■UV adhesive solutionPrecise Gauge's unique know-how eliminates deterioration in mounting accuracy due to heat shrinkage caused by UV irradiation, and enables UV bonding with an accuracy of 1 μm or less.

■Configuration・Manipulator mechanism part
・SUS standard hand
・Standard objective lens: ×2.5
・Manipulator control unit
・Manipulator control software
・Dedicated PC
・Simple image measurement software

Model
There is 1 model available for this product.

Product
Microchip manipulator

Handling Company
Precise Gauge Co., Ltd.

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1 Models of Microchip manipulator

Image	Part Number	Price (excluding tax)	Opening/closing operation	Feed screw pitch	Overload resistance	Travel amount (XY/θ)	Amount of movement	Moving display	Standard finger	Body rotation	Gripping force sensor	Small XYZ stage operation	Base stage operation	Table size (θ stage)	Table size	Θ microtremor
	Microchip manipulator	Available upon quote	Maximum 2mm target opening/closing on one side, remote electric	0.5mm	1kg	150mm/360°	±5mm	0.1μm linear scale	A pair attached	180° notch method, manual	G display compatible	XY: Manual, Z: Remote electric	Remote electric and manual combination	Φ80mm	30mm	±3°

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About Company Handling This Product

Precise Gauge Co., Ltd.

Japan

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Microchip manipulator Precise Gauge Co., Ltd.

About This Product

■Summary

■Features

■Fusion solution

■UV adhesive solution

■Configuration

1 Models of Microchip manipulator