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Wafer equipment Fully automatic ring cleaner RC-250 for labor saving when reusing ring frames-RC-250
Wafer equipment Fully automatic ring cleaner RC-250 for labor saving when reusing ring frames-EARS Co., Ltd.

Wafer equipment Fully automatic ring cleaner RC-250 for labor saving when reusing ring frames
EARS Co., Ltd.


About This Product

■Device overview

This is a fully automatic device that removes the dicing tape from the ring frame from which good chips have been removed, wipes the surface of the ring frame, cleans it, aligns the orientation, and stacks it in the collection area.

■Equipment features

・After setting the cassette, turn on the switch to remove the tape, wash it, and store it completely automatically. ・Automatically performs phase adjustment, warp detection, and alignment of the ring frame. - Optimal cleaning conditions can be set depending on the tape used. - Store the removed dicing tape in a special box. Pull it out from the back of the device and dispose of it.

■Points

- Significant labor savings can be achieved by fully automatically performing tape removal work, which is an auxiliary work. ・Compared to manual work, the frequency of handling organic solvents is significantly reduced, which is effective in terms of safety and health.

  • Product

    Wafer equipment Fully automatic ring cleaner RC-250 for labor saving when reusing ring frames

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1 Models of Wafer equipment Fully automatic ring cleaner RC-250 for labor saving when reusing ring frames

Image Part Number Price (excluding tax) Weight Applicable wiper Applicable tape Cleaning liquid Dimensions Height Dimensions Width Dimensions Depth Processing capacity (reference value) Source Utility Tape frame
Wafer equipment Fully automatic ring cleaner RC-250 for labor saving when reusing ring frames-Part Number-RC-250

RC-250

Available upon quote

750Kg

Benliese TS-100 roll type

UV tape

IPA and MEK

2,140mm

1,800mm

1,100mm

Approximately 30 seconds/sheet

Three-phase AC200V

Dry air (0.4MPa or more)

MODTF2-6-1

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