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  4. MEMS sensor element assembly equipment TCM-1000 (PFA Co., Ltd.)
MEMS sensor element assembly equipment TCM-1000-TCM-1000
MEMS sensor element assembly equipment TCM-1000-PFA Co., Ltd.

MEMS sensor element assembly equipment TCM-1000
PFA Co., Ltd.

PFA Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

92.9hours

About This Product

■Summary

・This device is equipped with a MEMS sensor element. ・After applying the paste to the board, mounting the MEMS sensor element, and overcoating the paste on the element electrode, the process is automatically performed until collection on the tray.

■Features

- Applying the technology cultivated with crystal blank mounters, we use INDEX to realize compact equipment and high-performance parts assembly. - Highly accurate assembly is possible because the position of the board/element is measured using image processing and the position is corrected before assembly. ・We use image processing to inspect the coating amount and condition to minimize the outflow of defects. - Measures the board height using a laser displacement meter to minimize variations in coating quality.

■Usage example

・In addition to MEMS sensors, we can also assemble small electronic devices such as capacitors, LED-related devices, human detection sensors, and photoelectric sensors. ・We design according to customer requests. Please contact us. *Please note that the appearance and specifications may be partially changed in order to improve performance.

  • Product

    MEMS sensor element assembly equipment TCM-1000

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1 Models of MEMS sensor element assembly equipment TCM-1000

Image Part Number Price (excluding tax) Parts supply/discharge Equipment weight Image inspection function Image position correction Mounting accuracy Glue Target work (element) Target work (board) External dimensions Application diameter Cycle time
MEMS sensor element assembly equipment TCM-1000-Part Number-TCM-1000

TCM-1000

Available upon quote

Tray (10-tier magazine)

Approximately 1,500Kg

Coating diameter, element not installed, element misalignment, etc.

Substrate position, element position

Within ±30μm

Conductive adhesive (silicon-based, epoxy-based, etc.)

Various elements MIN□1mm~MAX□8mm (Other sizes are also available)

Various substrates MIN□2mm~MAX□10mm (Other sizes are also available)

W1,650×D1,550×H1,700mm (excluding patrol light)

Φ0.1~φ0.6 (varies depending on the adhesive used)

Approximately 1.0 seconds/piece (varies depending on process conditions)

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About Company Handling This Product

PFA Co., Ltd.

Response Rate

100.0%

Response Time

92.9hrs

  • Japan

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Semiconductor Manufacturing Equipment Component & Part Machining　PFA Co., Ltd.
PFA Co., Ltd.

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