MEMS sensor element assembly equipment TCM-1000
PFA Co., Ltd.
About This Product
■Summary
・This device is equipped with a MEMS sensor element.
・After applying the paste to the board, mounting the MEMS sensor element, and overcoating the paste on the element electrode, the process is automatically performed until collection on the tray.
■Features
- Applying the technology cultivated with crystal blank mounters, we use INDEX to realize compact equipment and high-performance parts assembly.
- Highly accurate assembly is possible because the position of the board/element is measured using image processing and the position is corrected before assembly.
・We use image processing to inspect the coating amount and condition to minimize the outflow of defects.
- Measures the board height using a laser displacement meter to minimize variations in coating quality.
■Usage example
・In addition to MEMS sensors, we can also assemble small electronic devices such as capacitors, LED-related devices, human detection sensors, and photoelectric sensors.
・We design according to customer requests. Please contact us.
*Please note that the appearance and specifications may be partially changed in order to improve performance.
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Product
MEMS sensor element assembly equipment TCM-1000
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Handling Company
PFA Co., Ltd.
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Categories
1 Models of MEMS sensor element assembly equipment TCM-1000
| Product Image | Part Number | Price (excluding tax) | Application diameter | Cycle time | Equipment weight | External dimensions | Glue | Image inspection function | Image position correction | Mounting accuracy | Parts supply/discharge | Target work (board) | Target work (element) |
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TCM-1000 |
Available upon quote | Φ0.1~φ0.6 (varies depending on the adhesive used) | Approximately 1.0 seconds/piece (varies depending on process conditions) | Approximately 1,500Kg | W1,650×D1,550×H1,700mm (excluding patrol light) | Conductive adhesive (silicon-based, epoxy-based, etc.) | Coating diameter, element not installed, element misalignment, etc. | Substrate position, element position | Within ±30μm | Tray (10-tier magazine) | Various substrates MIN□2mm~MAX□10mm (Other sizes are also available) | Various elements MIN□1mm~MAX□8mm (Other sizes are also available) |
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About Company Handling This Product
- Japan