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Crystal device manufacturing Frequency adjustment machine Laser trimming equipment-PLT-10
Crystal device manufacturing Frequency adjustment machine Laser trimming equipment-PFA Co., Ltd.

Crystal device manufacturing Frequency adjustment machine Laser trimming equipment
PFA Co., Ltd.

PFA Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

92.9hours


About This Product

■Summary

・This is a device that adjusts the oscillation frequency by laser trimming the metal thin film of a tuning fork crystal resonator formed on a wafer. ・Achieves high throughput through multiple simultaneous measurements.

■Features

- Realizes high-speed trimming operation with green laser. ・Achieves high throughput by measuring multiple items simultaneously. ・Uses high-speed, high-accuracy, and high-reliability measurement circuit. ・Automatic transport is achieved using a loader/unloader. ・Display production management information in real time. - Comes with an automatic probe cleaning mechanism.

■Usage example

This is a device that uses a laser to remove the thin metal film of a tuning fork crystal resonator formed on a wafer to adjust the oscillation frequency.

■Optional support

- The number of simultaneous probing can be increased from 81 chips to 160 chips. - Supports multiple types of different wafer chips by replacing dedicated jigs. ・We will suggest the best trimming conditions for your product. Please contact us. Example) Picosecond/nanosecond laser, near-infrared/green laser, etc. *Please note that the appearance and specifications may be partially changed in order to improve performance.

  • Product

    Crystal device manufacturing Frequency adjustment machine Laser trimming equipment

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2 Models of Crystal device manufacturing Frequency adjustment machine Laser trimming equipment

Click on the part number for more information about each product

Image Part Number Price (excluding tax) Parts supply/storage Image position correction Target work size Target work External dimensions: No NG chip break-off function External dimensions: With NG chip break-off function Number of simultaneous measurements Cycle time Option
Crystal device manufacturing Frequency adjustment machine Laser trimming equipment-Part Number-PLT-10

PLT-10

Available upon quote

Loader: Supply wafers from magazine, Unloader: Store wafers in magazine

Chip position

4 inch wafer or less

Tuning fork crystal wafer (Model changes can be made by replacing special parts.)

W1,000×D1,500×H1,750mm (excluding protrusions such as Hepa filter, computer, and patrol light)

W1,400×D1,600×H1,800mm (excluding protrusions such as Hepa filter and Patlite)

Number of simultaneous probing: 80 chips or less

Approximately 0.5 seconds/piece *Takt time varies depending on the number of chips, thickness of processed film, amount of processing, and number of processing.

The number of simultaneous probing can be increased from 81 chips to 160 chips.
Supports multiple products by replacing dedicated jigs

Crystal device manufacturing Frequency adjustment machine Laser trimming equipment-Part Number-PLT-20

PLT-20

Available upon quote

Loader: Supply wafers from magazine, Unloader: Store wafers in magazine

Chip position

4 inch wafer or less

Tuning fork crystal wafer (Model changes can be made by replacing special parts.)

W1,000×D1,500×H1,750mm (excluding protrusions such as Hepa filter, computer, and patrol light)

W1,400×D1,600×H1,800mm (excluding protrusions such as Hepa filter and Patlite)

Number of simultaneous probing: 80 chips or less

Approximately 0.5 seconds/piece *Takt time varies depending on the number of chips, thickness of processed film, amount of processing, and number of processing.

The number of simultaneous probing can be increased from 81 chips to 160 chips.
Supports multiple products by replacing dedicated jigs

Click on the part number for more information about each product

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About Company Handling This Product

Response Rate

100.0%


Response Time

92.9hrs

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