Crystal device manufacturing Frequency adjustment machine Laser trimming equipment
PFA Co., Ltd.
About This Product
■Summary
・This is a device that adjusts the oscillation frequency by laser trimming the metal thin film of a tuning fork crystal resonator formed on a wafer.
・Achieves high throughput through multiple simultaneous measurements.
■Features
- Realizes high-speed trimming operation with green laser.
・Achieves high throughput by measuring multiple items simultaneously.
・Uses high-speed, high-accuracy, and high-reliability measurement circuit.
・Automatic transport is achieved using a loader/unloader.
・Display production management information in real time.
- Comes with an automatic probe cleaning mechanism.
■Usage example
This is a device that uses a laser to remove the thin metal film of a tuning fork crystal resonator formed on a wafer to adjust the oscillation frequency.
■Optional support
- The number of simultaneous probing can be increased from 81 chips to 160 chips.
- Supports multiple types of different wafer chips by replacing dedicated jigs.
・We will suggest the best trimming conditions for your product. Please contact us.
Example) Picosecond/nanosecond laser, near-infrared/green laser, etc.
*Please note that the appearance and specifications may be partially changed in order to improve performance.
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Product
Crystal device manufacturing Frequency adjustment machine Laser trimming equipment
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Handling Company
PFA Co., Ltd.
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Categories
2 Models of Crystal device manufacturing Frequency adjustment machine Laser trimming equipment
Items marked with have different values depending on the model number.
Click on the part number for more information about each product
| Product Image | Part Number | Price (excluding tax) | Cycle time | External dimensions: No NG chip break-off function | External dimensions: With NG chip break-off function | Image position correction | Number of simultaneous measurements | Option | Parts supply/storage | Target work | Target work size |
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PLT-10 |
Available upon quote | Approximately 0.5 seconds/piece *Takt time varies depending on the number of chips, thickness of processed film, amount of processing, and number of processing. | W1,000×D1,500×H1,750mm (excluding protrusions such as Hepa filter, computer, and patrol light) | W1,400×D1,600×H1,800mm (excluding protrusions such as Hepa filter and Patlite) | Chip position | Number of simultaneous probing: 80 chips or less |
The number of simultaneous probing can be increased from 81 chips to 160 chips. Supports multiple products by replacing dedicated jigs |
Loader: Supply wafers from magazine, Unloader: Store wafers in magazine | Tuning fork crystal wafer (Model changes can be made by replacing special parts.) | 4 inch wafer or less |
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PLT-20 |
Available upon quote | Approximately 0.5 seconds/piece *Takt time varies depending on the number of chips, thickness of processed film, amount of processing, and number of processing. | W1,000×D1,500×H1,750mm (excluding protrusions such as Hepa filter, computer, and patrol light) | W1,400×D1,600×H1,800mm (excluding protrusions such as Hepa filter and Patlite) | Chip position | Number of simultaneous probing: 80 chips or less |
The number of simultaneous probing can be increased from 81 chips to 160 chips. Supports multiple products by replacing dedicated jigs |
Loader: Supply wafers from magazine, Unloader: Store wafers in magazine | Tuning fork crystal wafer (Model changes can be made by replacing special parts.) | 4 inch wafer or less |
Click on the part number for more information about each product
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About Company Handling This Product
- Japan