High-speed blank mounter for crystal blanks PBM-1100
PFA Co., Ltd.
About This Product
■Summary
・This is the industry's highest level equipment that applies adhesive to the SMD type crystal device package and mounts the crystal blank, achieving a takt time of 0.7 seconds.
・We also have a lineup of equipment that directly breaks off and mounts chips from crystal wafers. Obtained Japanese Patent No. 4949937.
・We have made repeated improvements in pursuit of ease of use and high-precision mounting, and have established the No. 1 position in the industry since its release.
■Features
・A high-precision, high-performance mounter that can handle small packages such as 1612/1210/1008.
・This device uses a digital camera and new lighting to achieve high measurement accuracy, performs measurements and inspections using PFA's original image processing system, and contributes to improving product quality.
・High rigidity has been improved by using the frame, base integrated structure, and cast metal, and a takt time of 0.7 seconds/piece has been achieved.
・This device is equipped with IoT/product quality improvement/self-diagnosis functions, such as managing the usage time and number of times main parts and consumable parts are used, and managing the usage time and number of times adhesives are applied.
- Aggregation from measurement data is possible. In addition, it is possible to record up to 50 past image results measured by each camera, contributing to defect analysis.
■Usage example
This is an assembly device that applies adhesive to the package of an SMD type crystal device and mounts a crystal piece (blank).
■Optional support
- Dual application unit mechanism.
・A mechanism that breaks off a crystal chip from a crystal wafer of 4 inches or less in size and mounts the broken off crystal chip on a package coated with adhesive. Obtained Japanese Patent No. 4949937.
・Function to measure the height difference between the package seal surface and the blank surface using a laser displacement meter after mounting a crystal piece (blank).
・Expansion of target varieties.
- Can be connected in-line with a clean curing furnace (4 installed machines and 1 hardening furnace connected, 2 installed machines and 1 hardening furnace connected).
Product specs
■External mold size
・Standard specifications: W1,400 x D1,400 x H1,700mm (excluding protrusions such as Hepa filter, monitor, and patrol light)
・With crystal wafer chip break-off mechanism: W1,600 x D1,650 x H1,700mm (excluding protrusions such as Hepa filter, monitor, and patrol light)
*Please note that the appearance and specifications may be partially changed in order to improve performance.
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Product
High-speed blank mounter for crystal blanks PBM-1100
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Handling Company
PFA Co., Ltd.
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Categories
1 Models of High-speed blank mounter for crystal blanks PBM-1100
| Product Image | Part Number | Price (excluding tax) | Application amount | Application position accuracy | Blank mounting accuracy | Cycle time | Glue | Image inspection function | Image position correction | Option | Parts supply/discharge | Target work | Target work size |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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PBM-1100 |
Available upon quote | 3σ: φ150μm±30μm (using PFA specified adhesive and needle) | 3σ: within ±30μm | 3σ: within ±30μm |
Standard specifications: approx. 0.7 seconds/piece or less (for 2-point application) With crystal wafer chip break-off mechanism: approx. 1.0 seconds/piece or less (in case of 2-point coating) |
Conductive adhesive (silicon-based, epoxy-based, etc.) | Coating amount, coating position, blank mounting position (blank position deviation), blank not mounted | Package (position) measurement, blank (position) measurement | Can be connected in-line with a clean curing furnace | Tray (set in 10-tier magazine) | SMD type crystal unit and oscillator |
3.2×2.5, 2.5×2.0, 2.0×1.6, 1.6×1.2, 1.2×1.0, 1.0×0.8 (mm) *However, the standard specifications are 3 types with similar dimensions. |
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About Company Handling This Product
- Japan