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Silicon ingot/waferHandling Company
Shinyo Co., Ltd.Categories
Image | Part Number | Price (excluding tax) | Transmission wavelength range (μ) | Melting point | Color | Crystal manufacturing method | Crystal structure | Thermal expansion coefficient | Thermal conductivity | Specific gravity | Specific heat | Maximum operating temperature | Bending strength | Compressive strength | Return loss (for 2 surfaces) | Chemical composition | Cleavage plane | Volume resistivity | Young's modulus | Mohs hardness | Poisson's ratio | Vickers hardness | Knoop hardness |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Silicon ingot/wafer |
Available upon quote |
1.2~15.0 |
1,420℃ |
Metallic luster |
CZ |
Equiaxed diamond type |
4.15×10-6/℃ (10~50℃) |
0.39cal/cmsec℃ (40℃) |
2.329 (25℃) |
0.168cal/g℃ (25℃) |
1,300℃ |
~300MPa (25℃) |
20,800kg/cm2 |
46.1% (10μ) |
Si |
111 |
2.4×10^4Ω・cm (25℃) |
190GPa |
7 |
0.27 |
1,040Kgf/mm2 |
1,150kg/mm2 |
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Reviews shown here are reviews of companies.