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Film thickness distribution measuring device FiDiCa® H series high resolution model FDC-H1510-FDC-H1510
Film thickness distribution measuring device FiDiCa® H series high resolution model FDC-H1510-JFE Techno Research Co., Ltd.

Film thickness distribution measuring device FiDiCa® H series high resolution model FDC-H1510
JFE Techno Research Co., Ltd.


About This Product

■Measure and visualize film thickness distribution quickly and accurately without contact

・A two-dimensional spectroscopic interference film thickness meter that can map the film thickness distribution of semiconductors, films, liquid films, etc. without contact at high speed and with high precision. ・Supports measurement of a wide range of film thicknesses (thin film, thick film, extremely thick film) from 50 nm to 800 μm ・High measurement accuracy using spectral interferometry ・High-speed calculation of measurement data from 1 million to 4 million points in a few minutes using a unique algorithm ・Can be customized from offline desktop equipment to inline equipment ・Supports multilayer film measurement

■What is film thickness measurement using optical interference?

Film thickness measurement using optical interference is a standard method in the semiconductor and film industries that determines film thickness values ​​from the spectral intensity (spectrum) of interference that occurs between light reflected from the front and back surfaces of the measurement target. FiDiCa® has a rich lineup and can measure film thicknesses from 50nm to 800μm. As a concrete example ・For semiconductors: Thickness of oxide film, resist, etc. on silicon wafer. It is also possible to control the thickness of various wafers themselves. Based on the film thickness information on the surface, it is possible to not only check whether the thickness is within the control value, but also detect trends in the thickness and local defects. - For films: It is possible to measure not only the thickness unevenness of the original film, but also coatings and multilayers on top of it. (Depends on the material and layer structure) By using the film thickness information on the surface, it is possible to inspect streak-like defects and unevenness in the width direction, which was impossible with conventional point film thickness meters. ・Other examples: It is used in a wide range of applications where thickness control is an issue, such as electronic components, semiconductor materials, oil films, liquid films, and adhesives.

■Features

・Capable of measuring the entire surface of a 6-inch wafer ・Capable of measuring the entire sample surface and local thickness with high resolution (approximately 5 μm) ・Compact design that can be installed on a tabletop

■Main uses

Film thickness distribution measurement on device patterns, etc.

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    Film thickness distribution measuring device FiDiCa® H series high resolution model FDC-H1510

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1 Models of Film thickness distribution measuring device FiDiCa® H series high resolution model FDC-H1510

Image Part Number Price (excluding tax) Measurement film thickness range Equipment size Repeatability Spatial resolution Measurement speed Number of measurement points Measurement size
Film thickness distribution measuring device FiDiCa® H series high resolution model FDC-H1510-Part Number-FDC-H1510

FDC-H1510

Available upon quote

100nm~10μm
*Depends on material and conditions.

W500×D620×H280mm

3σ<1.0nm
*With a calibrated SiO2 film on a 1 μm thick Si wafer.

Approximately 5μm

Local measurement: about 30 seconds
Full surface measurement: about 10 minutes
*Depends on material and conditions.

Approximately 200,000 items

Local measurement: Approximately 3mm square
Overall measurement: approx. 150mm
(6 inch wafer)

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