"Various functional DLC" Intelligent DLC by Plasmion Inject
Plasmion Assist

STD-DLC (standard)

×

×

<0.1μm

~ 0.1

~ 1010

~ 2000

○

○

◎

◎

◎

350 ℃

Aluminum, nickel, titanium, CR plating, ceramics, CFRP, rubber, resin, magnetic material material, SUS, high -steel, etc.

Aluminum sliding parts, hard CR wear countermeasures, various rolls, long, large members, manufacturing line consumable parts

At room temperature ~

LF-DLC (low friction)

○

×

<0.1μm

~ 0.06

~ 1012

~ 1500

◎

○

○

◎

◎

350 ℃

Aluminum, nickel, titanium, CR plating, ceramics, CFRP, rubber, resin, magnetic material material, SUS, high -steel, etc.

Rubber sliding parts, rubber rolls, resin (FRP), yinomido, sliding parts

At room temperature ~

F-DLC (fluorine gas barrier)

○

×

<0.1μm

~ 0.06

~ 1010

~ 600

◎

◎

△

△

◎

350 ℃

Aluminum, nickel, titanium, CR plating, ceramics, CFRP, rubber, resin, magnetic material material, SUS, high -steel, etc.

Rubber gasbariya countermeasures, film gasbariya countermeasures, resin gold -type measures

At room temperature ~

HCA-DLC (high water repellent)

◎

×

<0.1μm

~ 0.02

~ 1010

~ 1000

◎

◎

△

△

◎

350 ℃

Aluminum, nickel, titanium, CR plating, ceramics, CFRP, rubber, resin, magnetic material material, SUS, high -steel, etc.

Nano -print molds, rolls, viscosity countermeasures, resin gold molds, and viscosity material manufacturing lines

At room temperature ~

UHR-DLC (insulation)

○

×

<0.1μm

~ 0.2

1015 ~

~ 1200

△

○

○

○

◎

350 ℃

Aluminum, nickel, titanium, CR plating, ceramics, CFRP, rubber, resin, magnetic material material, SUS, high -steel, etc.

Alternative to fluororesin, resin mold molding countermeasures, insulation countermeasures for electronic components manufacturing lines

At room temperature ~

LR-DLC (conductive)

×

◎

<0.2μm

0.5

~ 10-3

~ 1000

△

○

×

△

◎

500 ° C

SUS, NI, aluminum, etc.

Fuel cell separator / capacitor collector / LI -ion battery collector, electrical measurement terminal, heater parts

~ 400 ℃

ND-DLC (Nano Daia)

×

◎

<0.2μm

0.5

~ 10-3

3000 ~

△

○

×

○

◎

500 ° C

Carbide, highce steel, etc.

Tools for fragile materials, tools, research projects for difficult cutting materials

400 ° C

LDP-DLC (low dielectric)

○

×

<0.1μm

~ 0.2

1015 ~

~ 1200

△

○

○

○

◎

350 ℃

Resin, ceramic, metal

Telecommunications front module, FPC cable, millimeter wave radar gas barrier, low -dielectric material, mechanical intensity, abrasion resistance measures

At room temperature ~