Dynamic viscoelasticity measuring device EPLEXOR 1,500℃ temperature chamber equipped series-25N
Dynamic viscoelasticity measuring device EPLEXOR 1,500℃ temperature chamber equipped series-Cosmo Trading Co., Ltd.

Dynamic viscoelasticity measuring device EPLEXOR 1,500℃ temperature chamber equipped series
Cosmo Trading Co., Ltd.


About This Product

■Product overview "CMC (ceramic matrix composite)", which has been attracting attention in the aircraft industry recently, has superior "higher temperature resistance" and "lighter weight" than conventional metals, and is highly effective in improving fuel efficiency, and is being used in aircraft engine parts and power generation equipment. is expected to progress further. However, until now there has been no dynamic rheological apparatus (DMA) that can evaluate mechanical properties in the operating temperature range. The latest lineup, the "EPLEXOR® HT Series", has been newly developed as a device that can measure high temperatures up to 1,500℃, with a new high-temperature chamber that was previously positioned as an option. Equipped with the same double drive as the standard EPLEXOR series, the new digital force/displacement sensor enables a wide range of measurements from minute deformation/load to large deformation, and high temperature measurement up to 1,500℃. ■Main features Equipped with the same double drive system as the Eplexor series. One device can be equipped with a standard temperature chamber (-150°C to 500°C) and a high-temperature chamber (room temperature to 1,500°C), and by switching the temperature chamber, it can handle a wide temperature range from -150°C to 1,500°C. Physical properties can be obtained. ・Newly developed 1,500℃ temperature chamber (maximum 1,000℃ specification also available) ・Gas purge system to prevent thermal oxidative deterioration ・Supports a wide range of measurements by replacing load sensors ・High load measurement of ±500N with double drive system ・Highly accurate detection of minute loads using digital load sensors ・Highly accurate detection of minute displacements using digital displacement sensors ・Supports tension, compression, and 3-point bending measurement modes ■Features when using standard temperature chamber ・Evaluation of nonlinear viscoelasticity under high strain ・Analysis of audible frequency range using master curve ・Tensile test (optional) ・Program to generate arbitrary waveforms and hysteresis analysis software

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    Dynamic viscoelasticity measuring device EPLEXOR 1,500℃ temperature chamber equipped series

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4 Models of Dynamic viscoelasticity measuring device EPLEXOR 1,500℃ temperature chamber equipped series

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Product Image Part Number Price (excluding tax) Device dimensions (width x depth x height) Frequency High temperature chamber 1,000℃ specification or 1,500℃ specification Maximum dynamic load Maximum dynamic strain Maximum static load Required power supply (capacity) Standard chamber Static strain control range Test mode Weight
Dynamic viscoelasticity measuring device EPLEXOR 1,500℃ temperature chamber equipped series-Part Number-25N

25N

Available upon quote 1,470mm x 750mm x 2,200mm 0.001~100Hz (Optional specifications: 0.0001~200Hz) Room temperature: ~1,000℃ or ~1,500℃
Heating rate: max. 50K/min
Time to reach 1,500℃: 30 minutes (ballistic heating)
±25N (50N) ±1.5mm (±3.0mm) ~25N (1,500N option) 220V/single phase 50A -160℃ ~ 500℃
Heating rate: max. 25℃/min
Cooling rate: max. 15℃/min (using liquid nitrogen)
~60mm Compatible tests, analysis, options 350kg
Dynamic viscoelasticity measuring device EPLEXOR 1,500℃ temperature chamber equipped series-Part Number-100N

100N

Available upon quote 1,470mm x 750mm x 2,200mm 0.001~100Hz (Optional specifications: 0.0001~200Hz) Room temperature: ~1,000℃ or ~1,500℃
Heating rate: max. 50K/min
Time to reach 1,500℃: 30 minutes (ballistic heating)
±100N (200N) ±1.5mm (±3.0mm) ~100N (1,500N option) 220V/single phase 50A -160℃ ~ 500℃
Heating rate: max. 25℃/min
Cooling rate: max. 15℃/min (using liquid nitrogen)
~60mm Temperature dispersion, frequency dispersion, strain dispersion, load dispersion, temperature/frequency dispersion (master curve), time dispersion/fatigue test
Master curve analysis (optional), hysteresis analysis (optional)
Creep/stress relaxation etc.
350kg
Dynamic viscoelasticity measuring device EPLEXOR 1,500℃ temperature chamber equipped series-Part Number-150N

150N

Available upon quote 1,470mm x 750mm x 2,200mm 0.001~100Hz (Optional specifications: 0.0001~200Hz) Room temperature: ~1,000℃ or ~1,500℃
Heating rate: max. 50K/min
Time to reach 1,500℃: 30 minutes (ballistic heating)
±150N (300N) ±1.5mm (±3.0mm) ~150N (1,500N option) 220V/single phase 50A -160℃ ~ 500℃
Heating rate: max. 25℃/min
Cooling rate: max. 15℃/min (using liquid nitrogen)
~60mm Temperature dispersion, frequency dispersion, strain dispersion, load dispersion, temperature/frequency dispersion (master curve), time dispersion/fatigue test
Master curve analysis (optional), hysteresis analysis (optional)
Creep/stress relaxation etc.
350kg
Dynamic viscoelasticity measuring device EPLEXOR 1,500℃ temperature chamber equipped series-Part Number-500N

500N

Available upon quote 1,470mm x 750mm x 2,200mm 0.001~100Hz (Optional specifications: 0.0001~200Hz) Room temperature: ~1,000℃ or ~1,500℃
Heating rate: max. 50K/min
Time to reach 1,500℃: 30 minutes (ballistic heating)
±500N (1,000N) ±1.5mm (±6.0mm) ~1,500N 220V/single phase 50A -160℃ ~ 500℃
Heating rate: max. 25℃/min
Cooling rate: max. 15℃/min (using liquid nitrogen)
~60mm Temperature dispersion, frequency dispersion, strain dispersion, load dispersion, temperature/frequency dispersion (master curve), time dispersion/fatigue test
Master curve analysis (optional), hysteresis analysis (optional)
Creep/stress relaxation etc.
400kg

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