High-performance board
Micro Semiconductor Research Co., Ltd.

About This Product

■SummaryWe supply various bonded wafer manufacturing substrates and GaN-SiC epi wafers as high-performance substrates. This is a board developed for control devices such as power devices, high voltage resistance, piezoelectric elements, self-driving vehicles for next-generation communication, robots, drones, and electric power.

Model
There are 3 models for this product.

Product
High-performance board

Handling Company
Micro Semiconductor Research Co., Ltd.

Categories

Semiconductor Manufacturing

Semiconductor Materials

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3 Models of High-performance board

Click on the part number for more information about each product

Image	Part Number	Price (excluding tax)	Applicable wafer size	Material	Thickness	Finishing	Polyimide
	SiC bond wafer	Available upon quote	100mm	Active layer: SiC Support substrate: Si or Poly-Sic	Active layer: 0.3~0.5μm Support substrate: 525μm	Active layer: polished Support substrate: etching	-
	Piezo bond wafer	Available upon quote	100mm	Active layer: PZT Support substrate: Si	Active layer: ~0.5μm Support substrate: 525μm	Active layer: polished Support substrate: etching	Adhesive curtain: 1μm
	Si-Pyrex bond wafer	Available upon quote	100mm	Active layer: Si Support substrate: Pyrex glass	Active layer: 1μm Support substrate: 525μm	Active layer: polished Support substrate: polished	-

Click on the part number for more information about each product

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About Company Handling This Product

Micro Semiconductor Research Co., Ltd.

Japan

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