Active layer 1μm SOI wafer
Micro Semiconductor Research Co., Ltd.

About This Product

■SummaryThe active layer is finished to a thickness of 1μm using grinding and polishing methods. Finishing the active layer around 1μm by machining is extremely difficult and has a low yield, but it is achieved using stable manufacturing technology.

There is also a method of implanting and finishing with the smart cut method and finishing with epitaxial growth to 1 μm, but this method is extremely expensive. Our company achieves this by grinding and polishing methods, which allows us to offer it at a low price. In addition, we have a track record of down to 0.9μm.

Model
There are 1 models for this product.

Product
Active layer 1μm SOI wafer

Handling Company
Micro Semiconductor Research Co., Ltd.

Categories

Semiconductor Manufacturing

Silicon Wafers

Semiconductor Manufacturing

Semiconductor Materials

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1 Models of Active layer 1μm SOI wafer

Image	Part Number	Price (excluding tax)	Size compatible with SOI wafer processing
	Active layer 1μm SOI wafer	Available upon quote	3 inches, 100mm, 125mm, 150mm, 200mm Note) 3-inch and 125mm wafers can be laser cut for larger diameters.