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SOI wafer specialized for MEMS
Micro Semiconductor Research Co., Ltd.


About This Product

■Summary

MSR provides SOI wafers with various structures specialized for MEMS devices. We have a track record of manufacturing SOI wafers with an active layer thickness of up to 0.9±0.2μm using the bonding, grinding and polishing method. If you require small quantities and quick delivery, you can choose from surplus stock SOI wafers. Our inventory list of over 1,000 types of SOI wafers is updated twice a month and delivered to your factory within 2 weeks. We accept orders starting from just one SOI wafer in stock.

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    SOI wafer specialized for MEMS

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1 Models of SOI wafer specialized for MEMS

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SOI wafer specialized for MEMS

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