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  4. Test pattern wafer for 3D NAND flash memory (Micro Semiconductor Research Co., Ltd.)

Test pattern wafer for 3D NAND flash memory
Micro Semiconductor Research Co., Ltd.

About This Product

■Summary

We are developing test pattern wafers for 3D NAND Flash memory, which is a cutting-edge technology in the semiconductor field. 64 pairs (128 layers) of SiO2 film and SiN film are stacked alternately on a 300mm silicon wafer, and then an oxide film and a hard mask ACL (amorphous carbon) film for etching are formed on top of the SiO2 film and SiN film. This is a test wafer patterned by applying resist through a film.

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    Test pattern wafer for 3D NAND flash memory

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1 Models of Test pattern wafer for 3D NAND flash memory

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Test wafer for 3D NAND Flash memory

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About Company Handling This Product

Micro Semiconductor Research Co., Ltd.

  • Japan

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Silicon Wafers
Silicon Wafers　Micro Semiconductor Research Co., Ltd.
Micro Semiconductor Research Co., Ltd.

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