This product is registered by Micro Semiconductor Research Co., Ltd..
About This Product
■Summary
We are developing test pattern wafers for 3D NAND Flash memory, which is a cutting-edge technology in the semiconductor field. 64 pairs (128 layers) of SiO2 film and SiN film are stacked alternately on a 300mm silicon wafer, and then an oxide film and a hard mask ACL (amorphous carbon) film for etching are formed on top of the SiO2 film and SiN film. This is a test wafer patterned by applying resist through a film.
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