This product is registered by Scott Design System Co., Ltd..
About This Product
A double access flexible board (double access FPC board) does not have a polyimide film, and the copper foil itself is the base material. Pasting a coverlay on both sides is similar to double-sided FPC, but this has one layer of copper foil, and the coverlay is pasted on the bottom side of the copper foil, a pattern is formed, and the coverlay on the top side is pasted. Manufactured using an attaching process.
Standard specifications
■Base material (3-layer material/2-layer material)
・Polyimide film: 12.5μm (1/2mil), 25μm (1mil), 50μm (2mil)
・Electrolytic copper foil/rolled copper foil: 9μm (1/4oz), 12μm (1/3oz), 17.5μm (1/2oz), 35μm (1oz)
■Cover material
・Polyimide film: 12.5μm (1/2mil), 25μm (1mil), 50μm (2mil)
・Cover coat: Photo solder resist
■Surface treatment
・Rust prevention treatment: Rust prevention treatment, heat-resistant rust prevention treatment
・Solder treatment: cream solder
・Plating processing: Electrolytic direct gold plating, electrolytic nickel/gold plating, electroless nickel/gold plating, soft gold plating, tin plating, solder plating (PB free), flux
■Reinforcement material
・Reinforcement film: polyimide, polyester
・Reinforcement plate: glass epoxy, polyimide
・Metal reinforcement plate: aluminum, SUS
*This is a standard specification. In reality, the specifications are checked and decided upon after consultation, so the specifications are not limited to those listed here.
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