Engineering ceramic aluminum nitride (ALN)-Aluminum nitride (ALN)
Engineering ceramic aluminum nitride (ALN)-Shimizu Shokai Co., Ltd.

Engineering ceramic aluminum nitride (ALN)
Shimizu Shokai Co., Ltd.


About This Product

■Summary Aluminum nitride is a nitride of aluminum and is a material with extremely high thermal conductivity. It has excellent heat dissipation, insulation, and thermal shock resistance, and is attracting attention as a substrate material. Metallization processing is possible for aluminum nitride substrates. ■Features ・High thermal conductivity and thermal emissivity, and high heat uniformity - Resistant to thermal shock and can withstand rapid heating and cooling ・Excellent electrical insulation ・Low thermal expansion matching that of Si prevents wafer deformation due to temperature changes and reduces particle generation due to peeling of deposited film. ・High corrosion resistance against fluorine gases ・Excellent plasma resistance ■Applications Plasma etcher parts, wafer chuck parts, wafer holding jigs for steppers, dummy wafers, heater soaking plates, semiconductor substrates, thin film circuit boards

  • Product

    Engineering ceramic aluminum nitride (ALN)

Share this product


60+ people viewing

Last viewed: 17 minutes ago


Free
Since our quotes are free, feel free to use our service.

No Phone Number Required
You won’t have to worry about receiving unnecessary calls.

2 Models of Engineering ceramic aluminum nitride (ALN)

Items marked with have different values depending on the model number.

Click on the part number for more information about each product

Product Image Part Number Price (excluding tax) Bending strength 20° (Mpa) Bulk density ( g/cm3) Color Dielectric constant 1MHz Dielectric strength (kV/mm) External dimensions Fracture toughness (Mpa・m1/2) Hardness (HV) (Gpa) Linear expansion coefficient RT~200℃ ( ×10^-6/℃) Linear expansion coefficient RT~400℃ Main component Plate thickness dimension Poisson's ratio Thermal conductivity 20℃ ( W/ ( m・K) ) Thermal emissivity (100%) Thermal shock resistance (℃) Volume resistivity 20℃ (Ω・cm) Water absorption rate (%) Young's modulus (Gpa)
Engineering ceramic aluminum nitride (ALN)-Part Number-Aluminum nitride (ALN)

Aluminum nitride (ALN)

Available upon quote 350 3 Beige 8.8 15 □200, □300, φ200, φ300, etc. 3 13 2.4 4.5 A.L.N. 0.25~30mm 0.29 170 0.9 400 >10^13 0 320
Engineering ceramic aluminum nitride (ALN)-Part Number-Aluminum nitride (ALN) (without auxiliary agent)

Aluminum nitride (ALN) (without auxiliary agent)

Available upon quote 300 3.2 Beige 8.8 15 □200, □300, φ200, φ300, etc. 3 13 2.4 4.5 A.L.N. 0.25~30mm 0.29 90 0.93 400 >10^13 0 430

Click on the part number for more information about each product

Customers who viewed this product also viewed

Other products of Shimizu Shokai Co., Ltd.


View more products of Shimizu Shokai Co., Ltd.

About Company Handling This Product

This is the version of our website addressed to speakers of English in the United States. If you are a resident of another country, please select the appropriate version of Metoree for your country in the drop-down menu.

Copyright © 2024 Metoree