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Engineering ceramic aluminum nitride (ALN)Handling Company
Shimizu Shokai Co., Ltd.Categories
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| Image | Part Number | Price (excluding tax) | Dielectric constant 1MHz | Color | Thermal shock resistance (℃) | Linear expansion coefficient RT~400℃ | Linear expansion coefficient RT~200℃ ( ×10^-6/℃) | Dielectric strength (kV/mm) | Hardness (HV) (Gpa) | Fracture toughness (Mpa･m1/2) | Thermal emissivity (100%) | Thermal conductivity 20℃ ( W/ ( m･K) ) | Plate thickness dimension | Bending strength 20° (Mpa) | Bulk density ( g/cm3) | External dimensions | Water absorption rate (%) | Volume resistivity 20℃ (Ω･cm) | Main component | Young's modulus (Gpa) | Poisson's ratio |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
Aluminum nitride (ALN) |
Available upon quote |
8.8 |
Beige |
400 |
4.5 |
2.4 |
15 |
13 |
3 |
0.9 |
170 |
0.25~30mm |
350 |
3 |
□200, □300, φ200, φ300, etc. |
0 |
>10^13 |
A.L.N. |
320 |
0.29 |
|
|
Aluminum nitride (ALN) (without auxiliary agent) |
Available upon quote |
8.8 |
Beige |
400 |
4.5 |
2.4 |
15 |
13 |
3 |
0.93 |
90 |
0.25~30mm |
300 |
3.2 |
□200, □300, φ200, φ300, etc. |
0 |
>10^13 |
A.L.N. |
430 |
0.29 |
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