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Engineering ceramic silicon nitride (Si3N4)Handling Company
Shimizu Shokai Co., Ltd.Categories
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Image | Part Number | Price (excluding tax) | Dielectric constant 1MHz | Color | Thermal shock resistance (℃) | Linear expansion coefficient RT~800℃ | Linear expansion coefficient RT~200℃ ( ×10^-6/℃) | Dielectric strength (kV/mm) | Hardness (HV) (Gpa) | Fracture toughness (Mpa・m1/2) | Thermal conductivity 20℃ ( W/ ( m・K) ) | Bending strength 20° (Mpa) | Bulk density ( g/cm3) | Water absorption rate (%) | Volume resistivity 20℃ (Ω・cm) | Main component | Young's modulus (Gpa) | Poisson's ratio | Dielectric constant 3GHz | Specific heat RT ( J/ ( kg・K) ) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Silicon nitride (Si3N4) |
Available upon quote |
8 |
Gray black |
700 |
3.2 |
2 |
8 |
15 |
6 |
Twenty five |
800 |
3.2 |
0 |
>10^14 |
Si3N4 |
290 |
0.29 |
8 |
630 |
|
Silicon nitride (Si3N4) (high strength) |
Available upon quote |
8 |
Gray black |
800 |
3.2 |
2 |
8 |
15 |
7 |
35 |
1,000 |
3.2 |
0 |
>10^14 |
Si3N4 |
300 |
0.3 |
- | - |
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